Grain boundary sliding as a significant mechanism of low temperature plastic deformation in ECAP aluminum

Nguyen Q. Chinh, György Vörös, Péter Szommer, Zenji Horita, Terence G. Langdon

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    16 Citations (Scopus)

    Abstract

    Recently, the stress-strain relationships of high purity Al and Cu were investigated over a wide range of strain by combining data obtained in conventional tensile and compression testing of annealed samples with data obtained after processing by equal-channel angular pressing (ECAP) to high imposed strains. It was shown that the nature of the macroscopic stress-strain relationship characteristically changes in different regions of the testing temperature. In the low temperature region the macroscopic stress-strain behavior shows a monotonously increasing tendency over the entire range of strain inherent in these experiments, while at high testing temperatures the flow stress increases only up to a certain strain. It was also shown that in the positive strain-hardening region the stress-strain relationship can be described by an exponential-power law constitutive equation which includes the main features of the conventional Hollomon power-law and the Voce exponential relationships. On the basis of this new equation, low and high temperature deformation regions can be defined. In the present work, additional results are reported on the mechanism of steady-state flow of pure Al deformed at low temperatures. Results obtained by compression and indentation tests on ECAP Al samples, in addition to atomic force microscopy (AFM), show that in the low temperature region grain boundary sliding (GBS) is a significant mechanism of plastic deformation at high strains.

    Original languageEnglish
    Title of host publicationNanomaterials by Severe Plastic Deformation, NanoSPD3 - Proceedings of the 3rd International Conference on Nanomaterials by Severe Plastics Deformation
    PublisherTrans Tech Publications Ltd
    Pages1001-1006
    Number of pages6
    ISBN (Print)0878499857, 9780878499854
    DOIs
    Publication statusPublished - Jan 1 2006
    Event3rd International Conference on Nanomaterials by Severe Plastics Deformation, NanoSPD3 - Fukuoka, Japan
    Duration: Sep 22 2005Sep 26 2005

    Publication series

    NameMaterials Science Forum
    Volume503-504
    ISSN (Print)0255-5476

    Other

    Other3rd International Conference on Nanomaterials by Severe Plastics Deformation, NanoSPD3
    Country/TerritoryJapan
    CityFukuoka
    Period9/22/059/26/05

    All Science Journal Classification (ASJC) codes

    • Materials Science(all)
    • Condensed Matter Physics
    • Mechanics of Materials
    • Mechanical Engineering

    Fingerprint

    Dive into the research topics of 'Grain boundary sliding as a significant mechanism of low temperature plastic deformation in ECAP aluminum'. Together they form a unique fingerprint.

    Cite this