Grain boundary structure and electrical properties in Nb-doped SrTiO3 bicrystals

Takahisa Yamamoto, Katsuro Hayashi, Yuichi Ikuhara, Taketo Sakuma

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

Grain boundary structure and electrical properties were examined for Nb-doped SrTiO3 bicrystals. Bicrystals with Σ1, cobalt-segregated Σ1, and small angle boundaries were prepared by hot joining technique. High-resolution transmission electron microscopy (HRTEM) study revealed that two single crystals were perfectly joined without any secondary phases in all kinds of bicrystals. Σ1 boundary exhibited linear I-V characteristic while non-linear I-V behavior appeared in cobalt-segregated Σ1 boundary in spite of the similar coherent boundary. On the other hand, it was found that non-linearity became remarkable by reduction of cooling-rate after joining even in a small angle boundary, whose dislocation structure is stable against annealing treatment. This result suggests that negative-charged point defects must play an important role on the formation of potential barriers.

Original languageEnglish
Pages (from-to)225-228
Number of pages4
JournalKey Engineering Materials
Issue number181-182
Publication statusPublished - 2000
Externally publishedYes

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Bicrystals
Grain boundaries
Electric properties
Cobalt
Joining
Point defects
High resolution transmission electron microscopy
Single crystals
Annealing
Cooling
strontium titanium oxide

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Grain boundary structure and electrical properties in Nb-doped SrTiO3 bicrystals. / Yamamoto, Takahisa; Hayashi, Katsuro; Ikuhara, Yuichi; Sakuma, Taketo.

In: Key Engineering Materials, No. 181-182, 2000, p. 225-228.

Research output: Contribution to journalArticle

Yamamoto, Takahisa ; Hayashi, Katsuro ; Ikuhara, Yuichi ; Sakuma, Taketo. / Grain boundary structure and electrical properties in Nb-doped SrTiO3 bicrystals. In: Key Engineering Materials. 2000 ; No. 181-182. pp. 225-228.
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