Grain boundary structure of ultrafine grained pure copper fabricated by accumulative roll bonding

Ken Ichi Ikeda, Kousuke Yamada, Naoki Takata, Fuyuki Yoshida, Hideharu Nakashima, Nobuhiro Tsuji

Research output: Contribution to journalArticle

17 Citations (Scopus)

Abstract

Grain boundary structures of ultrafine grained pure copper (Cu) fabricated by the accumulative roll bonding (ARB) have been studied. The atomic structures of grain boundaries in the ARB processed Cu (ARB-Cu) were observed by high resolution electron microscopy. In order to compare the grain boundaries in the ARB-Cu with equilibrium grain boundaries, the grain boundary energy and structure of symmetric tilt boundaries with (110) common axis in pure Cu were computed by molecular dynamics simulation (MD). The low angle boundaries in the ARBCu were basically described by conventional dislocation model and simultaneously there were some local structures having certainly high energy configurations. The grain boundaries with large misorientation in the ARB-Cu are basically described by the structural units predicted for the normal grain boundaries by MD. The present results indicate that the atomic structures of the boundaries in the Cu severely deformed by theARB are rather similar to those of the equilibrium grain boundaries, except for the local distortions.

Original languageEnglish
Pages (from-to)24-30
Number of pages7
JournalMaterials Transactions
Volume49
Issue number1
DOIs
Publication statusPublished - Jan 1 2008

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Roll bonding
Copper
Grain boundaries
grain boundaries
copper
atomic structure
Molecular dynamics
molecular dynamics
Crystal atomic structure
Ultrafine
High resolution electron microscopy
Computer simulation
misalignment
electron microscopy
simulation
energy

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Grain boundary structure of ultrafine grained pure copper fabricated by accumulative roll bonding. / Ikeda, Ken Ichi; Yamada, Kousuke; Takata, Naoki; Yoshida, Fuyuki; Nakashima, Hideharu; Tsuji, Nobuhiro.

In: Materials Transactions, Vol. 49, No. 1, 01.01.2008, p. 24-30.

Research output: Contribution to journalArticle

Ikeda, Ken Ichi ; Yamada, Kousuke ; Takata, Naoki ; Yoshida, Fuyuki ; Nakashima, Hideharu ; Tsuji, Nobuhiro. / Grain boundary structure of ultrafine grained pure copper fabricated by accumulative roll bonding. In: Materials Transactions. 2008 ; Vol. 49, No. 1. pp. 24-30.
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