Grain boundary structure of ultrafine grained pure copper fabricated by accumulative roll bonding

Ken Ichi Ikeda, Kousuke Yamada, Naoki Takata, Fuyuki Yoshida, Hideharu Nakashima, Nobuhiro Tsuji

Research output: Contribution to journalArticlepeer-review

20 Citations (Scopus)

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Engineering & Materials Science

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Chemical Compounds