Grain refinement for improved lead-Free solder joint reliability

K. Sweatman, S. D. Mcdonald, M. Whitewick, T. Nishimura, Kazuhiro Nogita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains, sometimes only a single grain. This combined with the high degree of anisotropy in the mechanical properties of the body-centred tetragonal beta-tin crystal is a significant factor in determining the response of the joint to the strain to which it is subject in service, with consequent implications for reliability. The superior reliability in joints with multiple small grains of random orientation suggests that it would be advantageous if the solder alloy could be made to solidify with that fine grain structure. In the study reported in this paper the effect of trace additions of selected elements on the grain structure of pure tin and lead-free solder alloys was observed. The elemental additions were chosen on the basis of previous research as well as an analysis of relevant binary phase diagrams. Solidification theory suggests that an objective of the addition should be to promote the rapid development of a constitutionally undercooled zone ahead of the advancing solid/liquid interface since this is known to favour the repeated nucleation required to achieve a fine grain structure. The results contribute to the growing body of knowledge on the development of microstructure in lead-free solder alloys.

Original languageEnglish
Title of host publicationIPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013
Pages561-589
Number of pages29
Publication statusPublished - Sep 12 2013
EventIPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013 - San Diego, CA, United States
Duration: Feb 19 2013Feb 21 2013

Publication series

NameIPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013
Volume1

Other

OtherIPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013
CountryUnited States
CitySan Diego, CA
Period2/19/132/21/13

Fingerprint

Grain refinement
Crystal microstructure
Soldering alloys
Tin
Phase diagrams
Solidification
Anisotropy
Nucleation
Electronic equipment
Mechanical properties
Crystals
Microstructure
Liquids
Lead-free solders

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Sweatman, K., Mcdonald, S. D., Whitewick, M., Nishimura, T., & Nogita, K. (2013). Grain refinement for improved lead-Free solder joint reliability. In IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013 (pp. 561-589). (IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013; Vol. 1).

Grain refinement for improved lead-Free solder joint reliability. / Sweatman, K.; Mcdonald, S. D.; Whitewick, M.; Nishimura, T.; Nogita, Kazuhiro.

IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013. 2013. p. 561-589 (IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013; Vol. 1).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sweatman, K, Mcdonald, SD, Whitewick, M, Nishimura, T & Nogita, K 2013, Grain refinement for improved lead-Free solder joint reliability. in IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, vol. 1, pp. 561-589, IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013, San Diego, CA, United States, 2/19/13.
Sweatman K, Mcdonald SD, Whitewick M, Nishimura T, Nogita K. Grain refinement for improved lead-Free solder joint reliability. In IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013. 2013. p. 561-589. (IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013).
Sweatman, K. ; Mcdonald, S. D. ; Whitewick, M. ; Nishimura, T. ; Nogita, Kazuhiro. / Grain refinement for improved lead-Free solder joint reliability. IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013. 2013. pp. 561-589 (IPC APEX EXPO Conference and Exhibition 2013, APEX EXPO 2013).
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