Grain refinement of pure nickel using equal-channel angular pressing

Koji Neishi, Zenji Horita, Terence G. Langdon

Research output: Contribution to journalArticle

132 Citations (Scopus)

Abstract

Nickel of 99.9% purity, with an initial grain size of ∼ 80 μm, was subjected to equal-channel angular pressing (ECAP) to a strain of ∼ 8 at room temperature. After ECAP, there was a homogeneous microstructure of very fine grains separated by high-angle boundaries. The average grain size was measured as ∼ 0.30 μm. Annealing of samples after ECAP revealed an abrupt increase in the grain size, to ∼ 4-5 μm, at temperature in the range of 473-573 K: it is shown this behavior is analogous to conventional recrystallization. The results for pure Ni are compared with data obtained when ECAP is applied to pure Al and pure Cu. It is concluded that pure Ni is an ideal model material for use in ECAP because the stacking fault energy, which is intermediate between that of pure Al and pure Cu, leads to a much smaller grain size than in pure Al but a more homogeneous microstructure than in pure Cu.

Original languageEnglish
Pages (from-to)54-58
Number of pages5
JournalMaterials Science and Engineering A
Volume325
Issue number1-2
DOIs
Publication statusPublished - Feb 28 2002

Fingerprint

Equal channel angular pressing
Grain refinement
pressing
Nickel
nickel
grain size
stacking fault energy
microstructure
Microstructure
Stacking faults
purity
Annealing
Temperature
annealing
room temperature

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Grain refinement of pure nickel using equal-channel angular pressing. / Neishi, Koji; Horita, Zenji; Langdon, Terence G.

In: Materials Science and Engineering A, Vol. 325, No. 1-2, 28.02.2002, p. 54-58.

Research output: Contribution to journalArticle

Neishi, Koji ; Horita, Zenji ; Langdon, Terence G. / Grain refinement of pure nickel using equal-channel angular pressing. In: Materials Science and Engineering A. 2002 ; Vol. 325, No. 1-2. pp. 54-58.
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