TY - GEN
T1 - Grasp Synergy Analysis Based on Contact Area of Fingers Using Thermal Signatures
AU - Tsuji, Tokuo
AU - Seki, Hidetoshi
AU - Inada, Daisuke
AU - Morooka, Ken Ichi
AU - Harada, Kensuke
AU - Tahara, Kenji
AU - Hikizu, Masatoshi
AU - Seki, Hiroaki
PY - 2018/10/15
Y1 - 2018/10/15
N2 - We propose a new method for analyzing human grasping motion using an infrared camera. This technique simplifies the teaching of motion to robots based on the observation of human motion. In this method, the contact area on the object is extracted by observing the thermal signature captured by an infrared camera. To understand the intention of human behavior, we propose a grasping identification method using 3D thermal signatures. In addition, we perform a principal component analysis on the contact area and the center of gravity for the contact area of each finger. This method expresses the grasp motion space with a small number of parameters and can be used to enable easy correspondence between human and robot hands. We confirm experimentally that the proposed method is effective for teaching motion to robot.
AB - We propose a new method for analyzing human grasping motion using an infrared camera. This technique simplifies the teaching of motion to robots based on the observation of human motion. In this method, the contact area on the object is extracted by observing the thermal signature captured by an infrared camera. To understand the intention of human behavior, we propose a grasping identification method using 3D thermal signatures. In addition, we perform a principal component analysis on the contact area and the center of gravity for the contact area of each finger. This method expresses the grasp motion space with a small number of parameters and can be used to enable easy correspondence between human and robot hands. We confirm experimentally that the proposed method is effective for teaching motion to robot.
UR - http://www.scopus.com/inward/record.url?scp=85056723586&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85056723586&partnerID=8YFLogxK
U2 - 10.23919/SICE.2018.8492623
DO - 10.23919/SICE.2018.8492623
M3 - Conference contribution
AN - SCOPUS:85056723586
T3 - 2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018
SP - 1386
EP - 1392
BT - 2018 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 57th Annual Conference of the Society of Instrument and Control Engineers of Japan, SICE 2018
Y2 - 11 September 2018 through 14 September 2018
ER -