Growth of Co/Cu multilayered thin films by electro-deposition

Y. Hayashi, C. G. Lee, B. H. Koo, T. Sato, M. Arita, M. Masuda

Research output: Contribution to journalArticle

9 Citations (Scopus)

Abstract

Electrochemical method has been applied for preparing Co/Cu multilayered thin films. The layers were electrodeposited after injecting Co and Cu containing solutions in a flow exchanged supporting electrolyte solution. In X-ray diffraction at low angle range a long period peak could be observed, and in the middle angle region a single broad peak showing an average lattice spacing of the film was observed. The electrical resistance showed the properties of Giant Magnetoresistance (GMR). The GMR ratio showed a variation against Cu layer thickness as expected for anti-ferromagnetically coupled films. The maximum GMR ratio obtained in this study was 6.2% at room temperature for the film of [Co 2.0 nm/Cu 1.0 nm]15. Though we need further studies for choosing suitable deposition conditions, the electrodeposition method is a promising method for producing multilayered thin films.

Original languageEnglish
Pages (from-to)1658-1661
Number of pages4
JournalPhysica Status Solidi (A) Applied Research
Volume201
Issue number8
DOIs
Publication statusPublished - Jun 1 2004

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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