Abstract
Electrochemical method has been applied for preparing Co/Cu multilayered thin films. The layers were electrodeposited after injecting Co and Cu containing solutions in a flow exchanged supporting electrolyte solution. In X-ray diffraction at low angle range a long period peak could be observed, and in the middle angle region a single broad peak showing an average lattice spacing of the film was observed. The electrical resistance showed the properties of Giant Magnetoresistance (GMR). The GMR ratio showed a variation against Cu layer thickness as expected for anti-ferromagnetically coupled films. The maximum GMR ratio obtained in this study was 6.2% at room temperature for the film of [Co 2.0 nm/Cu 1.0 nm]15. Though we need further studies for choosing suitable deposition conditions, the electrodeposition method is a promising method for producing multilayered thin films.
| Original language | English |
|---|---|
| Pages (from-to) | 1658-1661 |
| Number of pages | 4 |
| Journal | Physica Status Solidi (A) Applied Research |
| Volume | 201 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - Jun 1 2004 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics
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Growth of Co/Cu multilayered thin films by electro-deposition. / Hayashi, Y.; Lee, C. G.; Koo, B. H.; Sato, T.; Arita, M.; Masuda, M.
In: Physica Status Solidi (A) Applied Research, Vol. 201, No. 8, 01.06.2004, p. 1658-1661.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Growth of Co/Cu multilayered thin films by electro-deposition
AU - Hayashi, Y.
AU - Lee, C. G.
AU - Koo, B. H.
AU - Sato, T.
AU - Arita, M.
AU - Masuda, M.
PY - 2004/6/1
Y1 - 2004/6/1
N2 - Electrochemical method has been applied for preparing Co/Cu multilayered thin films. The layers were electrodeposited after injecting Co and Cu containing solutions in a flow exchanged supporting electrolyte solution. In X-ray diffraction at low angle range a long period peak could be observed, and in the middle angle region a single broad peak showing an average lattice spacing of the film was observed. The electrical resistance showed the properties of Giant Magnetoresistance (GMR). The GMR ratio showed a variation against Cu layer thickness as expected for anti-ferromagnetically coupled films. The maximum GMR ratio obtained in this study was 6.2% at room temperature for the film of [Co 2.0 nm/Cu 1.0 nm]15. Though we need further studies for choosing suitable deposition conditions, the electrodeposition method is a promising method for producing multilayered thin films.
AB - Electrochemical method has been applied for preparing Co/Cu multilayered thin films. The layers were electrodeposited after injecting Co and Cu containing solutions in a flow exchanged supporting electrolyte solution. In X-ray diffraction at low angle range a long period peak could be observed, and in the middle angle region a single broad peak showing an average lattice spacing of the film was observed. The electrical resistance showed the properties of Giant Magnetoresistance (GMR). The GMR ratio showed a variation against Cu layer thickness as expected for anti-ferromagnetically coupled films. The maximum GMR ratio obtained in this study was 6.2% at room temperature for the film of [Co 2.0 nm/Cu 1.0 nm]15. Though we need further studies for choosing suitable deposition conditions, the electrodeposition method is a promising method for producing multilayered thin films.
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U2 - 10.1002/pssa.200304643
DO - 10.1002/pssa.200304643
M3 - Article
AN - SCOPUS:3142765509
VL - 201
SP - 1658
EP - 1661
JO - Physica Status Solidi (A) Applied Research
JF - Physica Status Solidi (A) Applied Research
SN - 0031-8965
IS - 8
ER -