Growth orientations and mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5 on poly-crystalline Cu

Dekui Mu, Hideyuki Yasuda, Han Huang, Kazuhiro Nogita

Research output: Contribution to journalArticlepeer-review

40 Citations (Scopus)

Abstract

Lead-free solders are important materials in current generation electrical packages, due to the increasingly stringent legislative requirement aimed at reducing the use of lead. The lead-free solders based on the Sn-Cu system with Ni addition have become popular because of their superior soldering properties, as well as their comparatively low cost. This research investigates the effect of Ni addition on the growth morphologies, crystal orientations and mechanical properties of Cu 6Sn 5 at the interface between hyper-eutectic Sn-Cu high-temperature lead-free solder alloys and Cu substrates, prior to and after aging, by the use of X-ray diffraction (XRD), scanning electron microscopy (SEM) and nanoindentation. The (Cu,Ni) 6Sn 5 in Sn-Cu-Ni/Cu solder joints showed a more strongly oriented (1 0 1) texture, compared to the Cu 6Sn 5 in Sn-Cu/Cu solder joints. The Ni-induced (1 0 1) texture contributes to higher and more scattered average values with larger standard deviations in both elastic modulus and hardness for (Cu,Ni) 6Sn 5.

Original languageEnglish
Pages (from-to)38-46
Number of pages9
JournalJournal of Alloys and Compounds
Volume536
DOIs
Publication statusPublished - Sep 25 2012

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

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