Abstract
Lead-free solders are important materials in current generation electrical packages, due to the increasingly stringent legislative requirement aimed at reducing the use of lead. The lead-free solders based on the Sn-Cu system with Ni addition have become popular because of their superior soldering properties, as well as their comparatively low cost. This research investigates the effect of Ni addition on the growth morphologies, crystal orientations and mechanical properties of Cu 6Sn 5 at the interface between hyper-eutectic Sn-Cu high-temperature lead-free solder alloys and Cu substrates, prior to and after aging, by the use of X-ray diffraction (XRD), scanning electron microscopy (SEM) and nanoindentation. The (Cu,Ni) 6Sn 5 in Sn-Cu-Ni/Cu solder joints showed a more strongly oriented (1 0 1) texture, compared to the Cu 6Sn 5 in Sn-Cu/Cu solder joints. The Ni-induced (1 0 1) texture contributes to higher and more scattered average values with larger standard deviations in both elastic modulus and hardness for (Cu,Ni) 6Sn 5.
| Original language | English |
|---|---|
| Pages (from-to) | 38-46 |
| Number of pages | 9 |
| Journal | Journal of Alloys and Compounds |
| Volume | 536 |
| DOIs | |
| Publication status | Published - Sep 25 2012 |
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All Science Journal Classification (ASJC) codes
- Mechanics of Materials
- Mechanical Engineering
- Metals and Alloys
- Materials Chemistry
Cite this
Growth orientations and mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5 on poly-crystalline Cu. / Mu, Dekui; Yasuda, Hideyuki; Huang, Han; Nogita, Kazuhiro.
In: Journal of Alloys and Compounds, Vol. 536, 25.09.2012, p. 38-46.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Growth orientations and mechanical properties of Cu 6Sn 5 and (Cu,Ni) 6Sn 5 on poly-crystalline Cu
AU - Mu, Dekui
AU - Yasuda, Hideyuki
AU - Huang, Han
AU - Nogita, Kazuhiro
PY - 2012/9/25
Y1 - 2012/9/25
N2 - Lead-free solders are important materials in current generation electrical packages, due to the increasingly stringent legislative requirement aimed at reducing the use of lead. The lead-free solders based on the Sn-Cu system with Ni addition have become popular because of their superior soldering properties, as well as their comparatively low cost. This research investigates the effect of Ni addition on the growth morphologies, crystal orientations and mechanical properties of Cu 6Sn 5 at the interface between hyper-eutectic Sn-Cu high-temperature lead-free solder alloys and Cu substrates, prior to and after aging, by the use of X-ray diffraction (XRD), scanning electron microscopy (SEM) and nanoindentation. The (Cu,Ni) 6Sn 5 in Sn-Cu-Ni/Cu solder joints showed a more strongly oriented (1 0 1) texture, compared to the Cu 6Sn 5 in Sn-Cu/Cu solder joints. The Ni-induced (1 0 1) texture contributes to higher and more scattered average values with larger standard deviations in both elastic modulus and hardness for (Cu,Ni) 6Sn 5.
AB - Lead-free solders are important materials in current generation electrical packages, due to the increasingly stringent legislative requirement aimed at reducing the use of lead. The lead-free solders based on the Sn-Cu system with Ni addition have become popular because of their superior soldering properties, as well as their comparatively low cost. This research investigates the effect of Ni addition on the growth morphologies, crystal orientations and mechanical properties of Cu 6Sn 5 at the interface between hyper-eutectic Sn-Cu high-temperature lead-free solder alloys and Cu substrates, prior to and after aging, by the use of X-ray diffraction (XRD), scanning electron microscopy (SEM) and nanoindentation. The (Cu,Ni) 6Sn 5 in Sn-Cu-Ni/Cu solder joints showed a more strongly oriented (1 0 1) texture, compared to the Cu 6Sn 5 in Sn-Cu/Cu solder joints. The Ni-induced (1 0 1) texture contributes to higher and more scattered average values with larger standard deviations in both elastic modulus and hardness for (Cu,Ni) 6Sn 5.
UR - http://www.scopus.com/inward/record.url?scp=84861883093&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84861883093&partnerID=8YFLogxK
U2 - 10.1016/j.jallcom.2012.04.110
DO - 10.1016/j.jallcom.2012.04.110
M3 - Article
AN - SCOPUS:84861883093
VL - 536
SP - 38
EP - 46
JO - Journal of Alloys and Compounds
JF - Journal of Alloys and Compounds
SN - 0925-8388
ER -