Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor

Eiji Higurashi, Tadatomo Suga, Renshi Sawada

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    Abstract

    This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surface-activated bonding at a relatively low bonding temperature of 150°C. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm × 2.8 mm × 1 mm thick) was fabricated. The feasibility of displacement measurement based on grating interferometer was demonstrated using the prototype microsensor.

    Original languageEnglish
    Title of host publicationISOT 2009 - International Symposium on Optomechatronic Technologies
    Pages209-214
    Number of pages6
    DOIs
    Publication statusPublished - Dec 31 2009
    EventISOT 2009 - International Symposium on Optomechatronic Technologies - Istanbul, Turkey
    Duration: Sep 21 2009Sep 23 2009

    Publication series

    NameISOT 2009 - International Symposium on Optomechatronic Technologies

    Other

    OtherISOT 2009 - International Symposium on Optomechatronic Technologies
    Country/TerritoryTurkey
    CityIstanbul
    Period9/21/099/23/09

    All Science Journal Classification (ASJC) codes

    • Hardware and Architecture
    • Control and Systems Engineering
    • Electrical and Electronic Engineering

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