Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor

Eiji Higurashi, Tadatomo Suga, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper focuses on heterogeneous integration technology and its application in optical displacement microsensor. The integration is based on the Au-Au surface-activated bonding at a relatively low bonding temperature of 150°C. Applying this technique, an ultra-compact and thin optical displacement microsensor with three-dimensional structure (2.8 mm × 2.8 mm × 1 mm thick) was fabricated. The feasibility of displacement measurement based on grating interferometer was demonstrated using the prototype microsensor.

Original languageEnglish
Title of host publicationISOT 2009 - International Symposium on Optomechatronic Technologies
Pages209-214
Number of pages6
DOIs
Publication statusPublished - Dec 31 2009
EventISOT 2009 - International Symposium on Optomechatronic Technologies - Istanbul, Turkey
Duration: Sep 21 2009Sep 23 2009

Publication series

NameISOT 2009 - International Symposium on Optomechatronic Technologies

Other

OtherISOT 2009 - International Symposium on Optomechatronic Technologies
CountryTurkey
CityIstanbul
Period9/21/099/23/09

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Microsensors
Displacement measurement
Interferometers
Temperature

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Higurashi, E., Suga, T., & Sawada, R. (2009). Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor. In ISOT 2009 - International Symposium on Optomechatronic Technologies (pp. 209-214). [5326083] (ISOT 2009 - International Symposium on Optomechatronic Technologies). https://doi.org/10.1109/ISOT.2009.5326083

Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor. / Higurashi, Eiji; Suga, Tadatomo; Sawada, Renshi.

ISOT 2009 - International Symposium on Optomechatronic Technologies. 2009. p. 209-214 5326083 (ISOT 2009 - International Symposium on Optomechatronic Technologies).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Higurashi, E, Suga, T & Sawada, R 2009, Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor. in ISOT 2009 - International Symposium on Optomechatronic Technologies., 5326083, ISOT 2009 - International Symposium on Optomechatronic Technologies, pp. 209-214, ISOT 2009 - International Symposium on Optomechatronic Technologies, Istanbul, Turkey, 9/21/09. https://doi.org/10.1109/ISOT.2009.5326083
Higurashi E, Suga T, Sawada R. Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor. In ISOT 2009 - International Symposium on Optomechatronic Technologies. 2009. p. 209-214. 5326083. (ISOT 2009 - International Symposium on Optomechatronic Technologies). https://doi.org/10.1109/ISOT.2009.5326083
Higurashi, Eiji ; Suga, Tadatomo ; Sawada, Renshi. / Heterogeneous integration towards an ultra-compact and thin optical displacement microsensor. ISOT 2009 - International Symposium on Optomechatronic Technologies. 2009. pp. 209-214 (ISOT 2009 - International Symposium on Optomechatronic Technologies).
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