High-accuracy measurement on thermal displacement and strain distributions of electronic packaging

Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo

Research output: Contribution to journalArticle

Abstract

The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase'shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames.

Original languageEnglish
Pages (from-to)871-876
Number of pages6
JournalIEEJ Transactions on Electronics, Information and Systems
Volume126
Issue number7
DOIs
Publication statusPublished - Jan 1 2006

Fingerprint

Electronics packaging
Phase shifters
Shear strain
Interferometry
Packaging
Image processing
Resins
Heating
Glass
Silicon
Temperature
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

High-accuracy measurement on thermal displacement and strain distributions of electronic packaging. / Morita, Yasuyuki; Arakawa, Kazuo; Todo, Mitsugu.

In: IEEJ Transactions on Electronics, Information and Systems, Vol. 126, No. 7, 01.01.2006, p. 871-876.

Research output: Contribution to journalArticle

@article{aae52e5cb1104672bc439ae13d49a9d3,
title = "High-accuracy measurement on thermal displacement and strain distributions of electronic packaging",
abstract = "The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moir{\'e} interferometry. This method was developed using a wedge-glass-plate as a phase'shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames.",
author = "Yasuyuki Morita and Kazuo Arakawa and Mitsugu Todo",
year = "2006",
month = "1",
day = "1",
doi = "10.1541/ieejeiss.126.871",
language = "English",
volume = "126",
pages = "871--876",
journal = "IEEJ Transactions on Electronics, Information and Systems",
issn = "0385-4221",
publisher = "The Institute of Electrical Engineers of Japan",
number = "7",

}

TY - JOUR

T1 - High-accuracy measurement on thermal displacement and strain distributions of electronic packaging

AU - Morita, Yasuyuki

AU - Arakawa, Kazuo

AU - Todo, Mitsugu

PY - 2006/1/1

Y1 - 2006/1/1

N2 - The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase'shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames.

AB - The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase'shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames.

UR - http://www.scopus.com/inward/record.url?scp=33745765677&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33745765677&partnerID=8YFLogxK

U2 - 10.1541/ieejeiss.126.871

DO - 10.1541/ieejeiss.126.871

M3 - Article

VL - 126

SP - 871

EP - 876

JO - IEEJ Transactions on Electronics, Information and Systems

JF - IEEJ Transactions on Electronics, Information and Systems

SN - 0385-4221

IS - 7

ER -