High-accuracy measurement on thermal displacement and strain distributions of electronic packaging

Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo

Research output: Contribution to journalArticlepeer-review

Abstract

The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase'shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames.

Original languageEnglish
Pages (from-to)871-876
Number of pages6
JournalIEEJ Transactions on Electronics, Information and Systems
Volume126
Issue number7
DOIs
Publication statusPublished - Jan 1 2006

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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