TY - JOUR
T1 - High-accuracy measurement on thermal displacement and strain distributions of electronic packaging
AU - Morita, Yasuyuki
AU - Arakawa, Kazuo
AU - Todo, Mitsugu
PY - 2006/1/1
Y1 - 2006/1/1
N2 - The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase'shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames.
AB - The thermal deformation of electronic package, QFP (Quad Flat Package), was measured by phase-shifting moiré interferometry. This method was developed using a wedge-glass-plate as a phase'shifter to obtain the displacement fields with the sensitivity of 80 nm/line. Digital image processing was also introduced to determine the strain distributions quantitatively. Thermal loading was applied by heating the package from room temperature 25°C to an elevated temperature 100°C. The result showed that the normal and shear strains concentrated in the packaging resins around the silicon chip, mount island, and lead frames.
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U2 - 10.1541/ieejeiss.126.871
DO - 10.1541/ieejeiss.126.871
M3 - Article
AN - SCOPUS:33745765677
SN - 0385-4221
VL - 126
SP - 871
EP - 876
JO - IEEJ Transactions on Electronics, Information and Systems
JF - IEEJ Transactions on Electronics, Information and Systems
IS - 7
ER -