High adhesive strength Ni-P thin film on ZnS by an electroless deposition process

Naoki Okamoto, Megumi Miyamoto, Takeyasu Saito, Kazuo Kondo, Takafumi Fukumoto, masaki Hirota

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

Zinc sulfide (ZnS) and its related materials are important materials for UV light emitting diodes, flat panel displays, and IR windows. To utilize these optoelectronic devices for electronic products, it is necessary to make electric circuits or signal lines on the ZnS substrate. However, the films made by conventional processes have weak adhesive strength. To overcome this limitation, we developed an electroless deposition process to make nickel-phosphorus (Ni-P) film. The films made using our process showed high adhesive strength in tensile tests and were also of very uniform thickness.

Original languageEnglish
JournalElectrochemical and Solid-State Letters
Volume13
Issue number6
DOIs
Publication statusPublished - Apr 27 2010
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electrochemistry
  • Electrical and Electronic Engineering
  • Materials Science(all)
  • Chemical Engineering(all)
  • Physical and Theoretical Chemistry

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