TY - GEN
T1 - High dynamic ablation and injection by electric cavitation for wide range of materials
AU - Takahashi, Kazuki
AU - Arakawa, Yuta
AU - Yamanishi, Yoko
PY - 2016/2/26
Y1 - 2016/2/26
N2 - We have successfully carried out local reagent injection and perforation to materials of variety of hardness using bubble cavitation and plasma cavitation. Cavitation and plasma was generated by pulse discharge of microelectrode having special tip structure. Injection to soft material such as animal cell was performed only by cavitation of bubble, and perforation to hard materials such as seeds of plants or metals were achieved by synergistic effect of cavitation of bubble and plasma ablation. The novel device we produced has ability to perforate wide range of materials with high dynamic range of hardness.
AB - We have successfully carried out local reagent injection and perforation to materials of variety of hardness using bubble cavitation and plasma cavitation. Cavitation and plasma was generated by pulse discharge of microelectrode having special tip structure. Injection to soft material such as animal cell was performed only by cavitation of bubble, and perforation to hard materials such as seeds of plants or metals were achieved by synergistic effect of cavitation of bubble and plasma ablation. The novel device we produced has ability to perforate wide range of materials with high dynamic range of hardness.
UR - http://www.scopus.com/inward/record.url?scp=84971006451&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84971006451&partnerID=8YFLogxK
U2 - 10.1109/MEMSYS.2016.7421547
DO - 10.1109/MEMSYS.2016.7421547
M3 - Conference contribution
AN - SCOPUS:84971006451
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 21
EP - 24
BT - MEMS 2016 - 29th IEEE International Conference on Micro Electro Mechanical Systems
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 29th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2016
Y2 - 24 January 2016 through 28 January 2016
ER -