High frequency signal transmission characteristics of cone bump interconnections

A. Ikeda, N. Watanabe, T. Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

We evaluated high frequency signal transmission characteristics of coplanar waveguides fabricated using Au cone bump interconnections. Electroless Ni / Au bumps were used as counter-electrodes against the Au cone bumps. The signal transmission loss increased with the number of bump interconnections. At 40 GHz, the signal insertion loss due to the bump interconnections was 0.017 dB / bump with the 10 μm square size Ni / Au bumps. This value was small enough for application to radio-frequency devices. While, with the 5 μm square size Ni / Au bumps, open failure was observed between the bump interconnections. The open failure might be caused by decreasing of the contact pressure between the bumps, due to the mushroom-like shape of the Ni / Au bumps.

Original languageEnglish
Title of host publication2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs
Publication statusPublished - Dec 1 2011
Event2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan
Duration: Jan 31 2012Feb 2 2012

Publication series

Name2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Other

Other2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
CountryJapan
CityOsaka
Period1/31/122/2/12

All Science Journal Classification (ASJC) codes

  • Control and Systems Engineering

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