High-frequency signal transmission characteristics of coplanar waveguides with cone bump interconnections

Akihiro Ikeda, K. Kajiwara, N. Watanabe, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We evaluated high frequency signal transmission characteristics of coplanar waveguides fabricated using cone bump interconnections on flip-chip bonded surfaces. The signal insertion loss (S21 parameter) increased with the number of bump interconnections. At 40 GHz, the signal insertion loss due to the bump interconnections was 0.017 dB / bump. This value was small enough for application to most radio-frequency devices. Besides, the bump interconnections did not alter the characteristic impedance of the waveguide from the designed even at 40 GHz. The results indicate that the cone bump offers high-frequency signal data transmission lines for chip-stack integration of LSIs.

Original languageEnglish
Title of host publicationTENCON 2010 - 2010 IEEE Region 10 Conference
Pages2191-2195
Number of pages5
DOIs
Publication statusPublished - Dec 1 2010
Event2010 IEEE Region 10 Conference, TENCON 2010 - Fukuoka, Japan
Duration: Nov 21 2010Nov 24 2010

Publication series

NameIEEE Region 10 Annual International Conference, Proceedings/TENCON

Other

Other2010 IEEE Region 10 Conference, TENCON 2010
CountryJapan
CityFukuoka
Period11/21/1011/24/10

All Science Journal Classification (ASJC) codes

  • Computer Science Applications
  • Electrical and Electronic Engineering

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    Ikeda, A., Kajiwara, K., Watanabe, N., & Asano, T. (2010). High-frequency signal transmission characteristics of coplanar waveguides with cone bump interconnections. In TENCON 2010 - 2010 IEEE Region 10 Conference (pp. 2191-2195). [5686711] (IEEE Region 10 Annual International Conference, Proceedings/TENCON). https://doi.org/10.1109/TENCON.2010.5686711