High performance flip-chip technique for wide-band modules

Noboru Iwasaki, Fuminori Ishitsuka, Kazutoshi Kato

Research output: Contribution to conferencePaper

12 Citations (Scopus)

Abstract

A novel wide-band flip-chip technique is proposed, where optimized wide-gap coplanar waveguides are used to reduce the discontinuity. The flip-chip technique made it possible to achieve the return loss of over 28 dB up to 60 GHz.

Original languageEnglish
Pages207-209
Number of pages3
Publication statusPublished - Dec 1 1996
Externally publishedYes
EventProceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging - Napa Valley, CA, USA
Duration: Oct 28 1996Oct 30 1996

Other

OtherProceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging
CityNapa Valley, CA, USA
Period10/28/9610/30/96

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Coplanar waveguides

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Iwasaki, N., Ishitsuka, F., & Kato, K. (1996). High performance flip-chip technique for wide-band modules. 207-209. Paper presented at Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, .

High performance flip-chip technique for wide-band modules. / Iwasaki, Noboru; Ishitsuka, Fuminori; Kato, Kazutoshi.

1996. 207-209 Paper presented at Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, .

Research output: Contribution to conferencePaper

Iwasaki, N, Ishitsuka, F & Kato, K 1996, 'High performance flip-chip technique for wide-band modules', Paper presented at Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, 10/28/96 - 10/30/96 pp. 207-209.
Iwasaki N, Ishitsuka F, Kato K. High performance flip-chip technique for wide-band modules. 1996. Paper presented at Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, .
Iwasaki, Noboru ; Ishitsuka, Fuminori ; Kato, Kazutoshi. / High performance flip-chip technique for wide-band modules. Paper presented at Proceedings of the 1996 5th Topical Meeting on Electrical Performance of Electronic Packaging, Napa Valley, CA, USA, .3 p.
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