High-sensitivity measurement of thermal deformation in a stacked multichip package

Yasuyuki Morita, Kazuo Arakawa, Mitsugu Todo

Research output: Contribution to journalArticlepeer-review

7 Citations (Scopus)


The thermal deformation of a stacked multichip package, which is a newly developed electronic package, was measured by phase-shifting moiréinterferometry. We developed this method using a wedged glass plate as a phase shifter to obtain displacement fields having a sensitivity of 30 nm/line. This method also enabled the quantitative determination of the strain distributions in all observation areas. Thermal loading was applied from room temperature (25 °C) to elevated temperatures of 75 °C and 100 °C where the thermal strains were examined and compared. The results showed that the longitudinal strain εxx was concentrated at the ends of two silicon chips, and the longitudinal strain εyy increased between the two silicon chips. The shear strain γxy increased at the end of the lower silicon chip from 0.17% to 0.30% when the temperature increased by 25 °C.

Original languageEnglish
Pages (from-to)137-143
Number of pages7
JournalIEEE Transactions on Components and Packaging Technologies
Issue number1
Publication statusPublished - Mar 2007

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering


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