High speed microrobot actuation in a microfluidic chip by levitated structure with riblet surface

Masaya Hagiwara, Tomohiro Kawahara, Toru Iijima, Yoko Yamanishi, Fumihito Arai

Research output: Chapter in Book/Report/Conference proceedingConference contribution

18 Citations (Scopus)

Abstract

This paper presents the high speed microrobot actuation driven by permanent magnets in a microfluidic chip. The riblet surface, which is regularly arrayed V groove reduces the fluid friction and enables stable actuation in high speed. The comprehensive analysis of fluid force, the optimum design and its fabrication were conducted and proved the friction reduction by riblet. The Ni and Si composite fabrication was employed to form the optimum riblet shape on the microrobot surface by wet and dry etching. The evaluation experiments show the microrobot can actuate up to 90 Hs, which is 10 times higher than the original microrobot. In addition, it can be applied to cell manipulation without harm since the microrobot is covered by Si, which is bio-compatible. One of the applications of developed microrobot was demonstrated by assembling cell aggregation in high speed.

Original languageEnglish
Title of host publication2012 IEEE International Conference on Robotics and Automation, ICRA 2012
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages2517-2522
Number of pages6
ISBN (Print)9781467314039
DOIs
Publication statusPublished - Jan 1 2012
Externally publishedYes
Event 2012 IEEE International Conference on Robotics and Automation, ICRA 2012 - Saint Paul, MN, United States
Duration: May 14 2012May 18 2012

Publication series

NameProceedings - IEEE International Conference on Robotics and Automation
ISSN (Print)1050-4729

Other

Other 2012 IEEE International Conference on Robotics and Automation, ICRA 2012
Country/TerritoryUnited States
CitySaint Paul, MN
Period5/14/125/18/12

All Science Journal Classification (ASJC) codes

  • Software
  • Control and Systems Engineering
  • Artificial Intelligence
  • Electrical and Electronic Engineering

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