High-speed via hole filling using electrophoresis of Ag nanoparticles

Ryo Takigawa; Kohei Nitta; Akihiro Ikeda; Mitsuaki Kumazawa; Toshiharu Hirai; Michio Komatsu; Tanemasa Asano

doi:10.1109/3DIC.2015.7334570

High-speed via hole filling using electrophoresis of Ag nanoparticles

Ryo Takigawa, Kohei Nitta, Akihiro Ikeda, Mitsuaki Kumazawa, Toshiharu Hirai, Michio Komatsu, Tanemasa Asano

Integrated Electronic Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

As an alternative to conventional electroplating, we propose TSV filling using the electrophoresis of metal nanoparticles. Colloidal solution of Ag nanoparticles having a high zeta potential has been designed and made up. Via holes for the test experiment were prepared in a photoresist layer on a Au film which acts as anode. Ag nanoparticles were completely filled into the cavities of depth of 30 μm and diameter of 10 μm within one minute. After annealing at 250 °C, the electric conductivity was 1.57 × 10^-5 [ω·cm]. These results demonstrate the potentials of the application of electrophoresis of metal nanoparticles to high speed TSV filling.

Original language	English
Title of host publication	2015 International 3D Systems Integration Conference, 3DIC 2015
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	TS5.4.1-TS5.4.4
ISBN (Electronic)	9781467393850
DOIs	https://doi.org/10.1109/3DIC.2015.7334570
Publication status	Published - Nov 20 2015
Event	International 3D Systems Integration Conference, 3DIC 2015 - Sendai, Japan Duration: Aug 31 2015 → Sep 2 2015

Publication series

Name	2015 International 3D Systems Integration Conference, 3DIC 2015

Other

Other	International 3D Systems Integration Conference, 3DIC 2015
Country	Japan
City	Sendai
Period	8/31/15 → 9/2/15

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All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Cite this

Takigawa, R., Nitta, K., Ikeda, A., Kumazawa, M., Hirai, T., Komatsu, M., & Asano, T. (2015). High-speed via hole filling using electrophoresis of Ag nanoparticles. In 2015 International 3D Systems Integration Conference, 3DIC 2015 (pp. TS5.4.1-TS5.4.4). [7334570] (2015 International 3D Systems Integration Conference, 3DIC 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/3DIC.2015.7334570

High-speed via hole filling using electrophoresis of Ag nanoparticles. / Takigawa, Ryo; Nitta, Kohei; Ikeda, Akihiro; Kumazawa, Mitsuaki; Hirai, Toshiharu; Komatsu, Michio; Asano, Tanemasa.

2015 International 3D Systems Integration Conference, 3DIC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. TS5.4.1-TS5.4.4 7334570 (2015 International 3D Systems Integration Conference, 3DIC 2015).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Takigawa, R, Nitta, K, Ikeda, A, Kumazawa, M, Hirai, T, Komatsu, M & Asano, T 2015, High-speed via hole filling using electrophoresis of Ag nanoparticles. in 2015 International 3D Systems Integration Conference, 3DIC 2015., 7334570, 2015 International 3D Systems Integration Conference, 3DIC 2015, Institute of Electrical and Electronics Engineers Inc., pp. TS5.4.1-TS5.4.4, International 3D Systems Integration Conference, 3DIC 2015, Sendai, Japan, 8/31/15. https://doi.org/10.1109/3DIC.2015.7334570

Takigawa R, Nitta K, Ikeda A, Kumazawa M, Hirai T, Komatsu M et al. High-speed via hole filling using electrophoresis of Ag nanoparticles. In 2015 International 3D Systems Integration Conference, 3DIC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. TS5.4.1-TS5.4.4. 7334570. (2015 International 3D Systems Integration Conference, 3DIC 2015). https://doi.org/10.1109/3DIC.2015.7334570

Takigawa, Ryo ; Nitta, Kohei ; Ikeda, Akihiro ; Kumazawa, Mitsuaki ; Hirai, Toshiharu ; Komatsu, Michio ; Asano, Tanemasa. / High-speed via hole filling using electrophoresis of Ag nanoparticles. 2015 International 3D Systems Integration Conference, 3DIC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. TS5.4.1-TS5.4.4 (2015 International 3D Systems Integration Conference, 3DIC 2015).

@inproceedings{9faa763ec620498da721d01cdace67a1,

title = "High-speed via hole filling using electrophoresis of Ag nanoparticles",

abstract = "As an alternative to conventional electroplating, we propose TSV filling using the electrophoresis of metal nanoparticles. Colloidal solution of Ag nanoparticles having a high zeta potential has been designed and made up. Via holes for the test experiment were prepared in a photoresist layer on a Au film which acts as anode. Ag nanoparticles were completely filled into the cavities of depth of 30 μm and diameter of 10 μm within one minute. After annealing at 250 °C, the electric conductivity was 1.57 × 10-5 [ω·cm]. These results demonstrate the potentials of the application of electrophoresis of metal nanoparticles to high speed TSV filling.",

author = "Ryo Takigawa and Kohei Nitta and Akihiro Ikeda and Mitsuaki Kumazawa and Toshiharu Hirai and Michio Komatsu and Tanemasa Asano",

year = "2015",

month = "11",

day = "20",

doi = "10.1109/3DIC.2015.7334570",

language = "English",

series = "2015 International 3D Systems Integration Conference, 3DIC 2015",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "TS5.4.1--TS5.4.4",

booktitle = "2015 International 3D Systems Integration Conference, 3DIC 2015",

address = "United States",

}

TY - GEN

T1 - High-speed via hole filling using electrophoresis of Ag nanoparticles

AU - Takigawa, Ryo

AU - Nitta, Kohei

AU - Ikeda, Akihiro

AU - Kumazawa, Mitsuaki

AU - Hirai, Toshiharu

AU - Komatsu, Michio

AU - Asano, Tanemasa

PY - 2015/11/20

Y1 - 2015/11/20

N2 - As an alternative to conventional electroplating, we propose TSV filling using the electrophoresis of metal nanoparticles. Colloidal solution of Ag nanoparticles having a high zeta potential has been designed and made up. Via holes for the test experiment were prepared in a photoresist layer on a Au film which acts as anode. Ag nanoparticles were completely filled into the cavities of depth of 30 μm and diameter of 10 μm within one minute. After annealing at 250 °C, the electric conductivity was 1.57 × 10-5 [ω·cm]. These results demonstrate the potentials of the application of electrophoresis of metal nanoparticles to high speed TSV filling.

AB - As an alternative to conventional electroplating, we propose TSV filling using the electrophoresis of metal nanoparticles. Colloidal solution of Ag nanoparticles having a high zeta potential has been designed and made up. Via holes for the test experiment were prepared in a photoresist layer on a Au film which acts as anode. Ag nanoparticles were completely filled into the cavities of depth of 30 μm and diameter of 10 μm within one minute. After annealing at 250 °C, the electric conductivity was 1.57 × 10-5 [ω·cm]. These results demonstrate the potentials of the application of electrophoresis of metal nanoparticles to high speed TSV filling.

UR - http://www.scopus.com/inward/record.url?scp=84962323866&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84962323866&partnerID=8YFLogxK

U2 - 10.1109/3DIC.2015.7334570

DO - 10.1109/3DIC.2015.7334570

M3 - Conference contribution

AN - SCOPUS:84962323866

T3 - 2015 International 3D Systems Integration Conference, 3DIC 2015

SP - TS5.4.1-TS5.4.4

BT - 2015 International 3D Systems Integration Conference, 3DIC 2015

PB - Institute of Electrical and Electronics Engineers Inc.

ER -

Access to Document

10.1109/3DIC.2015.7334570