@inproceedings{9faa763ec620498da721d01cdace67a1,
title = "High-speed via hole filling using electrophoresis of Ag nanoparticles",
abstract = "As an alternative to conventional electroplating, we propose TSV filling using the electrophoresis of metal nanoparticles. Colloidal solution of Ag nanoparticles having a high zeta potential has been designed and made up. Via holes for the test experiment were prepared in a photoresist layer on a Au film which acts as anode. Ag nanoparticles were completely filled into the cavities of depth of 30 μm and diameter of 10 μm within one minute. After annealing at 250 °C, the electric conductivity was 1.57 × 10-5 [ω·cm]. These results demonstrate the potentials of the application of electrophoresis of metal nanoparticles to high speed TSV filling.",
author = "Ryo Takigawa and Kohei Nitta and Akihiro Ikeda and Mitsuaki Kumazawa and Toshiharu Hirai and Michio Komatsu and Tanemasa Asano",
note = "Publisher Copyright: {\textcopyright} 2015 IEEE. Copyright: Copyright 2017 Elsevier B.V., All rights reserved.; International 3D Systems Integration Conference, 3DIC 2015 ; Conference date: 31-08-2015 Through 02-09-2015",
year = "2015",
month = nov,
day = "20",
doi = "10.1109/3DIC.2015.7334570",
language = "English",
series = "2015 International 3D Systems Integration Conference, 3DIC 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "TS5.4.1--TS5.4.4",
booktitle = "2015 International 3D Systems Integration Conference, 3DIC 2015",
address = "United States",
}