Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit

Renshi Sawada, E. Higurashi, T. Ito

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.

Original languageEnglish
Pages (from-to)293-300
Number of pages8
JournalPrecision Engineering
Volume25
Issue number4
DOIs
Publication statusPublished - Oct 1 2001
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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