Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit

Renshi Sawada, E. Higurashi, T. Ito

Research output: Contribution to journalArticle

23 Citations (Scopus)

Abstract

A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.

Original languageEnglish
Pages (from-to)293-300
Number of pages8
JournalPrecision Engineering
Volume25
Issue number4
DOIs
Publication statusPublished - Oct 1 2001
Externally publishedYes

Fingerprint

Semiconductor lasers
Networks (circuits)
Turnaround time

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit. / Sawada, Renshi; Higurashi, E.; Ito, T.

In: Precision Engineering, Vol. 25, No. 4, 01.10.2001, p. 293-300.

Research output: Contribution to journalArticle

Sawada, Renshi ; Higurashi, E. ; Ito, T. / Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit. In: Precision Engineering. 2001 ; Vol. 25, No. 4. pp. 293-300.
@article{f2de087d81e749cd9ce132d141c888e8,
title = "Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit",
abstract = "A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.",
author = "Renshi Sawada and E. Higurashi and T. Ito",
year = "2001",
month = "10",
day = "1",
doi = "10.1016/S0141-6359(01)00082-4",
language = "English",
volume = "25",
pages = "293--300",
journal = "Precision Engineering",
issn = "0141-6359",
publisher = "Elsevier Inc.",
number = "4",

}

TY - JOUR

T1 - Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit

AU - Sawada, Renshi

AU - Higurashi, E.

AU - Ito, T.

PY - 2001/10/1

Y1 - 2001/10/1

N2 - A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.

AB - A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.

UR - http://www.scopus.com/inward/record.url?scp=0035479449&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035479449&partnerID=8YFLogxK

U2 - 10.1016/S0141-6359(01)00082-4

DO - 10.1016/S0141-6359(01)00082-4

M3 - Article

AN - SCOPUS:0035479449

VL - 25

SP - 293

EP - 300

JO - Precision Engineering

JF - Precision Engineering

SN - 0141-6359

IS - 4

ER -