Abstract
A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.
Original language | English |
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Pages (from-to) | 293-300 |
Number of pages | 8 |
Journal | Precision Engineering |
Volume | 25 |
Issue number | 4 |
DOIs | |
Publication status | Published - Oct 1 2001 |
Externally published | Yes |
All Science Journal Classification (ASJC) codes
- Engineering(all)