Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit

Renshi Sawada; E. Higurashi; T. Ito

doi:10.1016/S0141-6359(01)00082-4

Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit

Renshi Sawada, E. Higurashi, T. Ito

Research output: Contribution to journal › Article › peer-review

23 Citations (Scopus)

Abstract

A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.

Original language	English
Pages (from-to)	293-300
Number of pages	8
Journal	Precision Engineering
Volume	25
Issue number	4
DOIs	https://doi.org/10.1016/S0141-6359(01)00082-4
Publication status	Published - Oct 1 2001
Externally published	Yes

All Science Journal Classification (ASJC) codes

Engineering(all)

Access to Document

10.1016/S0141-6359(01)00082-4

Cite this

@article{f2de087d81e749cd9ce132d141c888e8,

title = "Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit",

abstract = "A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.",

author = "Renshi Sawada and E. Higurashi and T. Ito",

year = "2001",

month = oct,

day = "1",

doi = "10.1016/S0141-6359(01)00082-4",

language = "English",

volume = "25",

pages = "293--300",

journal = "Precision Engineering",

issn = "0141-6359",

publisher = "Elsevier Inc.",

number = "4",

}

TY - JOUR

T1 - Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit

AU - Sawada, Renshi

AU - Higurashi, E.

AU - Ito, T.

PY - 2001/10/1

Y1 - 2001/10/1

N2 - A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.

AB - A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.

UR - http://www.scopus.com/inward/record.url?scp=0035479449&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0035479449&partnerID=8YFLogxK

U2 - 10.1016/S0141-6359(01)00082-4

DO - 10.1016/S0141-6359(01)00082-4

M3 - Article

AN - SCOPUS:0035479449

VL - 25

SP - 293

EP - 300

JO - Precision Engineering

JF - Precision Engineering

SN - 0141-6359

IS - 4

ER -

Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit

Abstract

All Science Journal Classification (ASJC) codes

Access to Document

Other files and links

Fingerprint

Cite this