Abstract
A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.
| Original language | English |
|---|---|
| Pages (from-to) | 293-300 |
| Number of pages | 8 |
| Journal | Precision Engineering |
| Volume | 25 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - Oct 1 2001 |
| Externally published | Yes |
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All Science Journal Classification (ASJC) codes
- Engineering(all)
Cite this
Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit. / Sawada, Renshi; Higurashi, E.; Ito, T.
In: Precision Engineering, Vol. 25, No. 4, 01.10.2001, p. 293-300.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Highly accurate and quick bonding of a laser-diode chip onto a planar lightwave circuit
AU - Sawada, Renshi
AU - Higurashi, E.
AU - Ito, T.
PY - 2001/10/1
Y1 - 2001/10/1
N2 - A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.
AB - A method for accurately and quickly bonding a planar lightwaveguide circuit (PLC) and a laser diode is proposed. It is based on simultaneous auto-focusing on marks fabricated on the PLC and laser diode. Bonding equipment constructed to implement the method achieves alignment accuracy of ± 1 μm and greatly reduces the turn-around-time, i.e., the time from when the laser diode is picked up by the tweezers to completion of the bonding process.
UR - http://www.scopus.com/inward/record.url?scp=0035479449&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0035479449&partnerID=8YFLogxK
U2 - 10.1016/S0141-6359(01)00082-4
DO - 10.1016/S0141-6359(01)00082-4
M3 - Article
AN - SCOPUS:0035479449
VL - 25
SP - 293
EP - 300
JO - Precision Engineering
JF - Precision Engineering
SN - 0141-6359
IS - 4
ER -