Highly reliable plastic packaging for laser diode and photodiode modules used for access network

M. Fukuda, F. Ichikawa, Y. Yamada, Y. Inoue, Kazutoshi Kato, H. Sato, T. Sugie, H. Toba, J. Yoshida

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85% RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters.

Original languageEnglish
Pages (from-to)2158-2159
Number of pages2
JournalElectronics Letters
Volume33
Issue number25
DOIs
Publication statusPublished - Jan 1 1997
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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  • Cite this

    Fukuda, M., Ichikawa, F., Yamada, Y., Inoue, Y., Kato, K., Sato, H., Sugie, T., Toba, H., & Yoshida, J. (1997). Highly reliable plastic packaging for laser diode and photodiode modules used for access network. Electronics Letters, 33(25), 2158-2159. https://doi.org/10.1049/el:19971365