Highly reliable plastic packaging for laser diode and photodiode modules used for access network

M. Fukuda, F. Ichikawa, Y. Yamada, Y. Inoue, Kazutoshi Kato, H. Sato, T. Sugie, H. Toba, J. Yoshida

Research output: Contribution to journalArticle

6 Citations (Scopus)

Abstract

The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85% RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters.

Original languageEnglish
Pages (from-to)2158-2159
Number of pages2
JournalElectronics Letters
Volume33
Issue number25
DOIs
Publication statusPublished - Jan 1 1997
Externally publishedYes

Fingerprint

Photodiodes
Semiconductor lasers
Packaging
Plastics
Atmospheric humidity
Aging of materials
Temperature
Costs
Optical transmitters

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Highly reliable plastic packaging for laser diode and photodiode modules used for access network. / Fukuda, M.; Ichikawa, F.; Yamada, Y.; Inoue, Y.; Kato, Kazutoshi; Sato, H.; Sugie, T.; Toba, H.; Yoshida, J.

In: Electronics Letters, Vol. 33, No. 25, 01.01.1997, p. 2158-2159.

Research output: Contribution to journalArticle

Fukuda, M, Ichikawa, F, Yamada, Y, Inoue, Y, Kato, K, Sato, H, Sugie, T, Toba, H & Yoshida, J 1997, 'Highly reliable plastic packaging for laser diode and photodiode modules used for access network', Electronics Letters, vol. 33, no. 25, pp. 2158-2159. https://doi.org/10.1049/el:19971365
Fukuda, M. ; Ichikawa, F. ; Yamada, Y. ; Inoue, Y. ; Kato, Kazutoshi ; Sato, H. ; Sugie, T. ; Toba, H. ; Yoshida, J. / Highly reliable plastic packaging for laser diode and photodiode modules used for access network. In: Electronics Letters. 1997 ; Vol. 33, No. 25. pp. 2158-2159.
@article{dcfa5aa45b67440e944985166a20a332,
title = "Highly reliable plastic packaging for laser diode and photodiode modules used for access network",
abstract = "The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85{\%} RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters.",
author = "M. Fukuda and F. Ichikawa and Y. Yamada and Y. Inoue and Kazutoshi Kato and H. Sato and T. Sugie and H. Toba and J. Yoshida",
year = "1997",
month = "1",
day = "1",
doi = "10.1049/el:19971365",
language = "English",
volume = "33",
pages = "2158--2159",
journal = "Electronics Letters",
issn = "0013-5194",
publisher = "Institution of Engineering and Technology",
number = "25",

}

TY - JOUR

T1 - Highly reliable plastic packaging for laser diode and photodiode modules used for access network

AU - Fukuda, M.

AU - Ichikawa, F.

AU - Yamada, Y.

AU - Inoue, Y.

AU - Kato, Kazutoshi

AU - Sato, H.

AU - Sugie, T.

AU - Toba, H.

AU - Yoshida, J.

PY - 1997/1/1

Y1 - 1997/1/1

N2 - The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85% RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters.

AB - The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85% RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters.

UR - http://www.scopus.com/inward/record.url?scp=0031553158&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=0031553158&partnerID=8YFLogxK

U2 - 10.1049/el:19971365

DO - 10.1049/el:19971365

M3 - Article

AN - SCOPUS:0031553158

VL - 33

SP - 2158

EP - 2159

JO - Electronics Letters

JF - Electronics Letters

SN - 0013-5194

IS - 25

ER -