Highly reliable plastic packaging for laser diode and photodiode modules used for access network

M. Fukuda; F. Ichikawa; Y. Yamada; Y. Inoue; K. Kato; H. Sato; T. Sugie; H. Toba; J. Yoshida

doi:10.1049/el:19971365

Highly reliable plastic packaging for laser diode and photodiode modules used for access network

M. Fukuda, F. Ichikawa, Y. Yamada, Y. Inoue, K. Kato, H. Sato, T. Sugie, H. Toba, J. Yoshida

Research output: Contribution to journal › Article › peer-review

6 Citations (Scopus)

Abstract

The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85% RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters.

Original language	English
Pages (from-to)	2158-2159
Number of pages	2
Journal	Electronics Letters
Volume	33
Issue number	25
DOIs	https://doi.org/10.1049/el:19971365
Publication status	Published - 1997
Externally published	Yes

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1049/el:19971365

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title = "Highly reliable plastic packaging for laser diode and photodiode modules used for access network",

abstract = "The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85% RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters.",

author = "M. Fukuda and F. Ichikawa and Y. Yamada and Y. Inoue and K. Kato and H. Sato and T. Sugie and H. Toba and J. Yoshida",

year = "1997",

doi = "10.1049/el:19971365",

language = "English",

volume = "33",

pages = "2158--2159",

journal = "Electronics Letters",

issn = "0013-5194",

publisher = "Institution of Engineering and Technology",

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TY - JOUR

T1 - Highly reliable plastic packaging for laser diode and photodiode modules used for access network

AU - Fukuda, M.

AU - Ichikawa, F.

AU - Yamada, Y.

AU - Inoue, Y.

AU - Kato, K.

AU - Sato, H.

AU - Sugie, T.

AU - Toba, H.

AU - Yoshida, J.

PY - 1997

Y1 - 1997

N2 - The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85% RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters.

AB - The feasibility of plastic packaging for laser diode and photodiode modules is demonstrated from the viewpoint of reliability. The stable operation of these modules is confirmed under various long term aging tests, high humidity-high temperature tests (85°C, 85% RH) and temperature cycling tests (-40/+85°C). The plastic packaging for laser diode and photodiode modules is potentially suitable for low cost optical transmitters.

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U2 - 10.1049/el:19971365

DO - 10.1049/el:19971365

M3 - Article

AN - SCOPUS:0031553158

SN - 0013-5194

VL - 33

SP - 2158

EP - 2159

JO - Electronics Letters

JF - Electronics Letters

IS - 25

ER -

Highly reliable plastic packaging for laser diode and photodiode modules used for access network

Abstract

All Science Journal Classification (ASJC) codes

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