TY - JOUR
T1 - HVEM study of crack-tip dislocations in Si crystals prepared by FIB and twin-blade cutting method
AU - Tanaka, Masaki
AU - Higashida, Kenji
AU - Fukui, Toru
AU - Yokote, Tatsuo
N1 - Funding Information:
M.T. appreciates the support of Research Fellowships of the Japan Society for the Promotion of Science (JSPS) for Young Scientists. This work was partly supported by a Grant-in-Aid for JSPS Fellow from the Ministry of Education, Culture, Sports, Science and Technology.
Copyright:
Copyright 2009 Elsevier B.V., All rights reserved.
PY - 2004
Y1 - 2004
N2 - Crack-tip dislocations in silicon crystals have been examined by using high-voltage electron microscopy. Cracks were introduced by the Vickers indentation method at room temperature and the indented specimens were annealed at high temperatures to induce dislocations around crack tips under the presence of residual stress due to the indentation. A selected area around a crack tip was thinned by a focused ion beam (FIB) technique. Specimens were thinned in advance by a twin-blade cutting (TBC) method, which is a simple cutting process for saving FIB machine time. A combination of FIB and TBC can be a useful thinning procedure for the efficient preparation of transmission electron microscopy specimens. Characteristic dislocation structures were observed around the tip of a crack, aiding the elucidation of dislocation processes, which is essential to increase the fracture toughness of materials.
AB - Crack-tip dislocations in silicon crystals have been examined by using high-voltage electron microscopy. Cracks were introduced by the Vickers indentation method at room temperature and the indented specimens were annealed at high temperatures to induce dislocations around crack tips under the presence of residual stress due to the indentation. A selected area around a crack tip was thinned by a focused ion beam (FIB) technique. Specimens were thinned in advance by a twin-blade cutting (TBC) method, which is a simple cutting process for saving FIB machine time. A combination of FIB and TBC can be a useful thinning procedure for the efficient preparation of transmission electron microscopy specimens. Characteristic dislocation structures were observed around the tip of a crack, aiding the elucidation of dislocation processes, which is essential to increase the fracture toughness of materials.
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U2 - 10.1093/jmicro/dfh052
DO - 10.1093/jmicro/dfh052
M3 - Article
C2 - 15582956
AN - SCOPUS:13444250063
VL - 53
SP - 505
EP - 509
JO - Microscopy (Oxford, England)
JF - Microscopy (Oxford, England)
SN - 2050-5698
IS - 5
ER -