Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform

T. Ohyama, T. Yamada, Y. Akahori, M. Oguma, A. Sugita, K. Kato

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A hybrid integrated differential photoreceiver has been successfully fabricated which comprises a dual photodiode (dual-PD) and a high-speed GaAs amplifier integrated circuit (IC) on a planar lightwave circuit (PLC) platform with integrated metal-insulation-metal (MIM) structural capacitors by using a novel flip-chip bonding technique. The bandwidth of the photoreceiver is wide enough to receive a 12 Gbits/s Manchester-encoded optical signal.

Original languageEnglish
Pages (from-to)1971-1973
Number of pages3
JournalElectronics Letters
Volume35
Issue number22
DOIs
Publication statusPublished - Oct 28 1999

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Structural metals
Photodiodes
Integrated circuits
Insulation
Capacitors
Bandwidth
Networks (circuits)
Metals

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform. / Ohyama, T.; Yamada, T.; Akahori, Y.; Oguma, M.; Sugita, A.; Kato, K.

In: Electronics Letters, Vol. 35, No. 22, 28.10.1999, p. 1971-1973.

Research output: Contribution to journalArticle

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