Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform

T. Ohyama; T. Yamada; Y. Akahori; M. Oguma; A. Sugita; K. Kato

doi:10.1049/el:19991294

Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform

T. Ohyama, T. Yamada, Y. Akahori, M. Oguma, A. Sugita, K. Kato

Research output: Contribution to journal › Article › peer-review

4 Citations (Scopus)

Abstract

A hybrid integrated differential photoreceiver has been successfully fabricated which comprises a dual photodiode (dual-PD) and a high-speed GaAs amplifier integrated circuit (IC) on a planar lightwave circuit (PLC) platform with integrated metal-insulation-metal (MIM) structural capacitors by using a novel flip-chip bonding technique. The bandwidth of the photoreceiver is wide enough to receive a 12 Gbits/s Manchester-encoded optical signal.

Original language	English
Pages (from-to)	1971-1973
Number of pages	3
Journal	Electronics Letters
Volume	35
Issue number	22
DOIs	https://doi.org/10.1049/el:19991294
Publication status	Published - Oct 28 1999
Externally published	Yes

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

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10.1049/el:19991294

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abstract = "A hybrid integrated differential photoreceiver has been successfully fabricated which comprises a dual photodiode (dual-PD) and a high-speed GaAs amplifier integrated circuit (IC) on a planar lightwave circuit (PLC) platform with integrated metal-insulation-metal (MIM) structural capacitors by using a novel flip-chip bonding technique. The bandwidth of the photoreceiver is wide enough to receive a 12 Gbits/s Manchester-encoded optical signal.",

author = "T. Ohyama and T. Yamada and Y. Akahori and M. Oguma and A. Sugita and K. Kato",

year = "1999",

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journal = "Electronics Letters",

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T1 - Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform

AU - Ohyama, T.

AU - Yamada, T.

AU - Akahori, Y.

AU - Oguma, M.

AU - Sugita, A.

AU - Kato, K.

PY - 1999/10/28

Y1 - 1999/10/28

N2 - A hybrid integrated differential photoreceiver has been successfully fabricated which comprises a dual photodiode (dual-PD) and a high-speed GaAs amplifier integrated circuit (IC) on a planar lightwave circuit (PLC) platform with integrated metal-insulation-metal (MIM) structural capacitors by using a novel flip-chip bonding technique. The bandwidth of the photoreceiver is wide enough to receive a 12 Gbits/s Manchester-encoded optical signal.

AB - A hybrid integrated differential photoreceiver has been successfully fabricated which comprises a dual photodiode (dual-PD) and a high-speed GaAs amplifier integrated circuit (IC) on a planar lightwave circuit (PLC) platform with integrated metal-insulation-metal (MIM) structural capacitors by using a novel flip-chip bonding technique. The bandwidth of the photoreceiver is wide enough to receive a 12 Gbits/s Manchester-encoded optical signal.

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DO - 10.1049/el:19991294

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JO - Electronics Letters

JF - Electronics Letters

IS - 22

ER -

Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform

Abstract

All Science Journal Classification (ASJC) codes

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