Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform

T. Ohyama, T. Yamada, Y. Akahori, M. Oguma, A. Sugita, K. Kato

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

A hybrid integrated differential photoreceiver has been successfully fabricated which comprises a dual photodiode (dual-PD) and a high-speed GaAs amplifier integrated circuit (IC) on a planar lightwave circuit (PLC) platform with integrated metal-insulation-metal (MIM) structural capacitors by using a novel flip-chip bonding technique. The bandwidth of the photoreceiver is wide enough to receive a 12 Gbits/s Manchester-encoded optical signal.

Original languageEnglish
Pages (from-to)1971-1973
Number of pages3
JournalElectronics Letters
Volume35
Issue number22
DOIs
Publication statusPublished - Oct 28 1999
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Hybrid integrated differential photoreceiver comprising dual-PD and high-speed GaAs amplifier IC assembled on planar lightwave circuit platform'. Together they form a unique fingerprint.

  • Cite this