A hybrid integrated differential photoreceiver has been successfully fabricated which comprises a dual photodiode (dual-PD) and a high-speed GaAs amplifier integrated circuit (IC) on a planar lightwave circuit (PLC) platform with integrated metal-insulation-metal (MIM) structural capacitors by using a novel flip-chip bonding technique. The bandwidth of the photoreceiver is wide enough to receive a 12 Gbits/s Manchester-encoded optical signal.
|Number of pages||3|
|Publication status||Published - Oct 28 1999|
All Science Journal Classification (ASJC) codes
- Electrical and Electronic Engineering