Hybrid integration technologies for optical micro-systems

E. Higurashi, T. Itoh, T. Suga, R. Sawada

Research output: Contribution to journalConference article

Abstract

Flip-chip bonding of various optical components (laser diode, photodiode, grating, etc) on a silicon substrate by passive optical alignment, which eliminates complicated optical axis precise alignment, has opened up many new possibilities in constructing highly functional, reliable, and low-cost optical micro-systems. Using this technique, several micro-sensors (< 2 × 3 mm2), including a blood flow sensor that can monitor blood flow in human skin, and a high-resolution encoder that can measure displacements or revolution angles, have been developed. Moreover, for future optical micro-systems, a novel method of a low temperature flip-chip bonding using surface activated bonding process has been introduced.

Original languageEnglish
Article number09
Pages (from-to)67-73
Number of pages7
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume5604
DOIs
Publication statusPublished - Dec 1 2004
EventOptomechatronic Micro/Nano Components, Devices, and Systems - Philadelphia, PA, United States
Duration: Oct 27 2004Oct 28 2004

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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