Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint

Flora Somidin, Hiroshi Maeno, Xuan Quy Tran, Stuart D. McDonald, Mohd Arif Anuar Mohd Salleh, Syo Matsumura, Kazuhiro Nogita

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained between Sn-0.7wt%Cu solder and Cu-Cu3Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that themonoclinic η'-Cu6Sn5 superlattice reflections appear in the hexagonal η-Cu6Sn5 diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the η'-Cu6Sn5 contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.

Original languageEnglish
Article number2229
JournalMaterials
Volume11
Issue number11
DOIs
Publication statusPublished - Nov 9 2018

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

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    Somidin, F., Maeno, H., Tran, X. Q., McDonald, S. D., Salleh, M. A. A. M., Matsumura, S., & Nogita, K. (2018). Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials, 11(11), [2229]. https://doi.org/10.3390/ma11112229