Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint

Flora Somidin, Hiroshi Maeno, Xuan Quy Tran, Stuart D. McDonald, Mohd Arif Anuar Mohd Salleh, Syo Matsumura, Kazuhiro Nogita

Research output: Contribution to journalArticle

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Abstract

In-situ observations of the polymorphic transformation in a single targeted Cu6Sn5 grain constrained between Sn-0.7wt%Cu solder and Cu-Cu3Sn phases and the associated structural evolution during a solid-state thermal cycle were achieved via a high-voltage transmission electron microscope (HV-TEM) technique. Here, we show that themonoclinic η'-Cu6Sn5 superlattice reflections appear in the hexagonal η-Cu6Sn5 diffraction pattern upon cooling to isothermal 140 °C from 210 °C. The in-situ real space imaging shows that the η'-Cu6Sn5 contrast pattern is initiated at the grain boundary. This method demonstrates a new approach for further understanding the polymorphic transformation behavior on a real solder joint.

Original languageEnglish
Article number2229
JournalMaterials
Volume11
Issue number11
DOIs
Publication statusPublished - Nov 9 2018

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Soldering alloys
Imaging techniques
Diffraction patterns
Grain boundaries
Electron microscopes
Cooling
Electric potential
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

Cite this

Somidin, F., Maeno, H., Tran, X. Q., McDonald, S. D., Salleh, M. A. A. M., Matsumura, S., & Nogita, K. (2018). Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. Materials, 11(11), [2229]. https://doi.org/10.3390/ma11112229

Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. / Somidin, Flora; Maeno, Hiroshi; Tran, Xuan Quy; McDonald, Stuart D.; Salleh, Mohd Arif Anuar Mohd; Matsumura, Syo; Nogita, Kazuhiro.

In: Materials, Vol. 11, No. 11, 2229, 09.11.2018.

Research output: Contribution to journalArticle

Somidin, F, Maeno, H, Tran, XQ, McDonald, SD, Salleh, MAAM, Matsumura, S & Nogita, K 2018, 'Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint', Materials, vol. 11, no. 11, 2229. https://doi.org/10.3390/ma11112229
Somidin, Flora ; Maeno, Hiroshi ; Tran, Xuan Quy ; McDonald, Stuart D. ; Salleh, Mohd Arif Anuar Mohd ; Matsumura, Syo ; Nogita, Kazuhiro. / Imaging the polymorphic transformation in a single Cu6Sn5 grain in a solder joint. In: Materials. 2018 ; Vol. 11, No. 11.
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