Immersion cooling of a simulated microelectronic chip with artificial reentrant cavities

Hiroshi Takamatsu, Hideo Kubo, Hiroshi Honda

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Abstract

Pool boiling heat transfer results for a 10 mm × 10 mm rectangular chip immersed in subcooled FC-72 were reported. Three kinds of surfaces were tested: an untreated silicon wafer surface, an etched surface of a thin SiO 2 film that was sputtered on a silicon wafer, and the same kind of SiO2 surface with artificial cavities. The cavities were a re-entrant type with mouth diameters ranging from 0.7 to 1.4 μm. These artificial cavities were effective in reducing the boiling incipience superheat. For degassed FC-72, the boiling incipience temperature agreed fairly well with the theoretical prediction of the heterogeneous nucleation theory. When the dissolved air content of the test liquid was sufficiently high, the chip temperatures at boiling incipience and at fully developed nucleate boiling were significantly decreased.

Original languageEnglish
Pages (from-to)1426-1432
Number of pages7
JournalNihon Kikai Gakkai Ronbunshu, B Hen/Transactions of the Japan Society of Mechanical Engineers, Part B
Volume64
Issue number621
DOIs
Publication statusPublished - May 1998

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All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Mechanical Engineering

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