TY - GEN
T1 - Immersive VR interface for informationally structured environment
AU - Pyo, Yoonseok
AU - Tsuji, Tokuo
AU - Hashiguchi, Yuuka
AU - Kurazume, Ryo
PY - 2015/8/25
Y1 - 2015/8/25
N2 - This paper presents a new immersive VR interface bridging cyber and physical worlds for Cyber Physical System (CPS). Informationaly structured environment (ISE) has been proposed in service robotics so far. In ISE, environmental information such as positions of objects, furniture, humans, and robots is gathered by embedded sensor networks and stored in a database structurally. A service robot is able to utilize these information anytime and anywhere by connecting to the network. In this paper, we introduce the ISE architecture named ROS-TMS and a new cyber-physical interface for ROS-TMS. The proposed system consists of an immersive wearable display, a stereo camera, an optical tracking system, and an environmental simulator, and is able to present forecasted images with high reality based on the structured information in ISE.
AB - This paper presents a new immersive VR interface bridging cyber and physical worlds for Cyber Physical System (CPS). Informationaly structured environment (ISE) has been proposed in service robotics so far. In ISE, environmental information such as positions of objects, furniture, humans, and robots is gathered by embedded sensor networks and stored in a database structurally. A service robot is able to utilize these information anytime and anywhere by connecting to the network. In this paper, we introduce the ISE architecture named ROS-TMS and a new cyber-physical interface for ROS-TMS. The proposed system consists of an immersive wearable display, a stereo camera, an optical tracking system, and an environmental simulator, and is able to present forecasted images with high reality based on the structured information in ISE.
UR - http://www.scopus.com/inward/record.url?scp=84951170979&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84951170979&partnerID=8YFLogxK
U2 - 10.1109/AIM.2015.7222802
DO - 10.1109/AIM.2015.7222802
M3 - Conference contribution
AN - SCOPUS:84951170979
T3 - IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM
SP - 1766
EP - 1771
BT - AIM 2015 - 2015 IEEE/ASME International Conference on Advanced Intelligent Mechatronics
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - IEEE/ASME International Conference on Advanced Intelligent Mechatronics, AIM 2015
Y2 - 7 July 2015 through 11 July 2015
ER -