TY - GEN
T1 - Impact for Radiated Noise by Current Smoothness with Bare SiC MOSFET and Si RC-IGBT Chips
AU - Tadakuma, Toshiya
AU - Rogers, Michael
AU - Nishi, Koichi
AU - Joko, Motonobu
AU - Shoyama, Masahito
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/7/26
Y1 - 2021/7/26
N2 - Power device structures have been improved to shrink area of chip and to reduce power loss. The switching speed has continued increasing to reduce switching loss, and electromagnetic noise also has been increasing and shifting to higher frequency. It is important to reduce generation of noise for establishing proper operation of power converters or inverters for motor control, thus simple switching behavior should be reconsidered anew. This report describes the relationship between switching behavior and intensity of the electric field at an antenna using electromagnetic potential and wavelet transform with switching data measured by extended double pulse test for bare SiC MOSFETs and Si RC-IGBTs.
AB - Power device structures have been improved to shrink area of chip and to reduce power loss. The switching speed has continued increasing to reduce switching loss, and electromagnetic noise also has been increasing and shifting to higher frequency. It is important to reduce generation of noise for establishing proper operation of power converters or inverters for motor control, thus simple switching behavior should be reconsidered anew. This report describes the relationship between switching behavior and intensity of the electric field at an antenna using electromagnetic potential and wavelet transform with switching data measured by extended double pulse test for bare SiC MOSFETs and Si RC-IGBTs.
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U2 - 10.1109/EMC/SI/PI/EMCEurope52599.2021.9559147
DO - 10.1109/EMC/SI/PI/EMCEurope52599.2021.9559147
M3 - Conference contribution
AN - SCOPUS:85118371518
T3 - 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021
SP - 1075
EP - 1080
BT - 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 Joint IEEE International Symposium on Electromagnetic Compatibility Signal and Power Integrity, and EMC Europe, EMC/SI/PI/EMC Europe 2021
Y2 - 26 July 2021 through 20 August 2021
ER -