Impact of a high pressure micro jet (HPMJ) on the conditioning and cleaning of unwoven fabric polyester pads in silicon polishing

Keiji Miyachi, Yoshiyuki Seike, Shinichi Haba, Syuhei Kurokawa, Toshiro K. Doi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

A novel conditioning technique using High Pressure Micro-Jet (HPMJ) with ultra pure water pressurized to 3-20 MPa was applied to unwoven fabric polyester pads to be used for silicon wafer CMP. In this study, HPMJ conditioning was compared between "no conditioning" and "brush conditioning", evaluating their performances by the removal rates, pad surface observations and SEM images. Rremoval rates of "no conditioning" and "brush conditioning" decreased due to clogging of the pad surfaces as number of polishing increased. The removal rates of HPMJ conditioning were 30 % higher than the brush conditioning when 20 wafers were polished. As a result, it has been confirmed that HPMJ is the most effective conditioning for unwoven fabric polyester pads in silicon polishing process.

Original languageEnglish
Title of host publicationICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings
PublisherVDE Verlag GmbH
Pages403-408
Number of pages6
ISBN (Electronic)9783800730650
Publication statusPublished - 2007
Event2007 International Conference on Planarization/CMP Technology, ICPT 2007 - Dresden, Germany
Duration: Oct 25 2007Oct 27 2007

Publication series

NameICPT 2007 - International Conference on Planarization/CMP Technology, Proceedings

Conference

Conference2007 International Conference on Planarization/CMP Technology, ICPT 2007
Country/TerritoryGermany
CityDresden
Period10/25/0710/27/07

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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