Impurity diffusion of Al and Cu in y-Fe

Osamu Taguchi, Miyuki Hagiwara, Yoshihiro Yamazaki, Yoshiaki Iijima

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

Impurity diffusion of Al and Cu in γ-Fe has been studied by using non-radioactive tracer elements. Penetration profiles have been determined by the lathe sectioning and the instrumental analyses, namely, absorptiometry for Al and atomic absorption analysis for Cu. Penetration curves obtained have been good for the diffusion analysis. The absorptiometry and atomic absorption analysis are found to be useful to measure the penetration profile for the impurity diffusion in metals where suitable radioisotope as a tracer is unavailable or the half-life of radioisotope is very short.

Original languageEnglish
Pages (from-to)91-96
Number of pages6
JournalDefect and Diffusion Forum
Issue number194-199 PART 1
Publication statusPublished - Jan 1 2001
Externally publishedYes

Fingerprint

penetration
Impurities
Radioisotopes
impurities
tracers
Radioactive tracers
profiles
half life
Metals
curves
metals

All Science Journal Classification (ASJC) codes

  • Radiation
  • Materials Science(all)
  • Condensed Matter Physics

Cite this

Taguchi, O., Hagiwara, M., Yamazaki, Y., & Iijima, Y. (2001). Impurity diffusion of Al and Cu in y-Fe. Defect and Diffusion Forum, (194-199 PART 1), 91-96.

Impurity diffusion of Al and Cu in y-Fe. / Taguchi, Osamu; Hagiwara, Miyuki; Yamazaki, Yoshihiro; Iijima, Yoshiaki.

In: Defect and Diffusion Forum, No. 194-199 PART 1, 01.01.2001, p. 91-96.

Research output: Contribution to journalArticle

Taguchi, O, Hagiwara, M, Yamazaki, Y & Iijima, Y 2001, 'Impurity diffusion of Al and Cu in y-Fe', Defect and Diffusion Forum, no. 194-199 PART 1, pp. 91-96.
Taguchi O, Hagiwara M, Yamazaki Y, Iijima Y. Impurity diffusion of Al and Cu in y-Fe. Defect and Diffusion Forum. 2001 Jan 1;(194-199 PART 1):91-96.
Taguchi, Osamu ; Hagiwara, Miyuki ; Yamazaki, Yoshihiro ; Iijima, Yoshiaki. / Impurity diffusion of Al and Cu in y-Fe. In: Defect and Diffusion Forum. 2001 ; No. 194-199 PART 1. pp. 91-96.
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