In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions

Kai Jiang, Hiroaki Nakano, Satoshi Oue, Tatsuya Morikawa, Wen huai Tian

Research output: Contribution to journalArticle

Abstract

The Ni samples were electroformed from additive-free (AF) and saccharin-containing (SC) sulfamate solutions, respectively. In situ backscattered electron (BSE) imaging, electron backscatter diffraction (EBSD), and electron-probe microanalysis (EPMA) were used to investigate the effect of annealing on the deformation behaviors of the AF and SC samples. The results indicate that columnar grains of the as-deposited AF sample had an approximated average width of 3 μm and an approximated aspect ratio of 8. The average width of columnar grains of the as-deposited SC sample was reduced to approximately 400 nm by the addition of saccharin to the electrolyte. A few very-large grains distributed in the matrix of the SC sample after annealing. No direct evidence indicated that S segregated at the grain boundaries before or after annealing. The average value of the total elongations of the SC samples decreased from 16% to 6% after annealing, whereas that of the AF samples increased from 18% to 50%. The dislocation recovery in grain-boundary areas of the annealed AF sample was reduced, which contributed to the appearance of microvoids at the triple junctions. The incompatibility deformation between very-large grains and fine grains contributed to the brittle fracture behavior of the annealed SC Ni.

Original languageEnglish
Pages (from-to)114-123
Number of pages10
JournalInternational Journal of Minerals, Metallurgy and Materials
Volume26
Issue number1
DOIs
Publication statusPublished - Jan 1 2019

Fingerprint

Saccharin
annealing
Annealing
Imaging techniques
electron
Electrons
grain boundary
Grain boundaries
brittle fracture
triple junction
incompatibility
Brittle fracture
Electron probe microanalysis
Dislocations (crystals)
dislocation
Electron diffraction
electron probe analysis
backscatter
electrolyte
diffraction

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Geochemistry and Petrology
  • Metals and Alloys
  • Materials Chemistry

Cite this

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title = "In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions",
abstract = "The Ni samples were electroformed from additive-free (AF) and saccharin-containing (SC) sulfamate solutions, respectively. In situ backscattered electron (BSE) imaging, electron backscatter diffraction (EBSD), and electron-probe microanalysis (EPMA) were used to investigate the effect of annealing on the deformation behaviors of the AF and SC samples. The results indicate that columnar grains of the as-deposited AF sample had an approximated average width of 3 μm and an approximated aspect ratio of 8. The average width of columnar grains of the as-deposited SC sample was reduced to approximately 400 nm by the addition of saccharin to the electrolyte. A few very-large grains distributed in the matrix of the SC sample after annealing. No direct evidence indicated that S segregated at the grain boundaries before or after annealing. The average value of the total elongations of the SC samples decreased from 16{\%} to 6{\%} after annealing, whereas that of the AF samples increased from 18{\%} to 50{\%}. The dislocation recovery in grain-boundary areas of the annealed AF sample was reduced, which contributed to the appearance of microvoids at the triple junctions. The incompatibility deformation between very-large grains and fine grains contributed to the brittle fracture behavior of the annealed SC Ni.",
author = "Kai Jiang and Hiroaki Nakano and Satoshi Oue and Tatsuya Morikawa and Tian, {Wen huai}",
year = "2019",
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T1 - In situ backscattered electron imaging study of the effect of annealing on the deformation behaviors of Ni electroformed from additive-free and saccharin-containing sulfamate solutions

AU - Jiang, Kai

AU - Nakano, Hiroaki

AU - Oue, Satoshi

AU - Morikawa, Tatsuya

AU - Tian, Wen huai

PY - 2019/1/1

Y1 - 2019/1/1

N2 - The Ni samples were electroformed from additive-free (AF) and saccharin-containing (SC) sulfamate solutions, respectively. In situ backscattered electron (BSE) imaging, electron backscatter diffraction (EBSD), and electron-probe microanalysis (EPMA) were used to investigate the effect of annealing on the deformation behaviors of the AF and SC samples. The results indicate that columnar grains of the as-deposited AF sample had an approximated average width of 3 μm and an approximated aspect ratio of 8. The average width of columnar grains of the as-deposited SC sample was reduced to approximately 400 nm by the addition of saccharin to the electrolyte. A few very-large grains distributed in the matrix of the SC sample after annealing. No direct evidence indicated that S segregated at the grain boundaries before or after annealing. The average value of the total elongations of the SC samples decreased from 16% to 6% after annealing, whereas that of the AF samples increased from 18% to 50%. The dislocation recovery in grain-boundary areas of the annealed AF sample was reduced, which contributed to the appearance of microvoids at the triple junctions. The incompatibility deformation between very-large grains and fine grains contributed to the brittle fracture behavior of the annealed SC Ni.

AB - The Ni samples were electroformed from additive-free (AF) and saccharin-containing (SC) sulfamate solutions, respectively. In situ backscattered electron (BSE) imaging, electron backscatter diffraction (EBSD), and electron-probe microanalysis (EPMA) were used to investigate the effect of annealing on the deformation behaviors of the AF and SC samples. The results indicate that columnar grains of the as-deposited AF sample had an approximated average width of 3 μm and an approximated aspect ratio of 8. The average width of columnar grains of the as-deposited SC sample was reduced to approximately 400 nm by the addition of saccharin to the electrolyte. A few very-large grains distributed in the matrix of the SC sample after annealing. No direct evidence indicated that S segregated at the grain boundaries before or after annealing. The average value of the total elongations of the SC samples decreased from 16% to 6% after annealing, whereas that of the AF samples increased from 18% to 50%. The dislocation recovery in grain-boundary areas of the annealed AF sample was reduced, which contributed to the appearance of microvoids at the triple junctions. The incompatibility deformation between very-large grains and fine grains contributed to the brittle fracture behavior of the annealed SC Ni.

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