In situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni

C. M. Gourlay, Kazuhiro Nogita, A. K. Dahle, Y. Yamamoto, K. Uesugi, T. Nagira, M. Yoshiya, H. Yasuda

Research output: Contribution to journalArticle

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Abstract

The dynamics of off-eutectic solidification are studied in two Pb-free solders using synchrotron X-ray radiography and post mortem scanning electron microscopy. The early stages of growth revealed the onset of coupled growth and phase competition. In Sn-0.7 wt.% Cu, the βSn-Cu 6 Sn 5 eutectic then grew with Cu 6 Sn 5 rods leading the βSn phase, with a range of rod spacings and local interface curvatures. However, these nonfaceted-faceted eutectic features were exhibited much more weakly than in the Al-Si and Fe-C eutectics, despite primary Cu 6 Sn 5 crystals exhibiting marked faceting. In Sn-0.7 wt.% Cu-0.06 wt.% Ni, primary intermetallic laths grew ahead of a rod-like βSn-(Cu,Ni) 6 Sn 5 univariant eutectic front. The univariant eutectic had a narrow freezing range and a similar spacing to the invariant eutectic at the same velocity. Composition measurements suggest that the univariant eutectic groove descends in the direction of the Sn + Cu 6 Sn 5 binary eutectic point.

Original languageEnglish
Pages (from-to)4043-4054
Number of pages12
JournalActa Materialia
Volume59
Issue number10
DOIs
Publication statusPublished - Jun 1 2011

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Eutectics
Solidification
X ray radiography
Synchrotrons
Freezing
Intermetallics
Crystals
Scanning electron microscopy
Chemical analysis

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

Cite this

Gourlay, C. M., Nogita, K., Dahle, A. K., Yamamoto, Y., Uesugi, K., Nagira, T., ... Yasuda, H. (2011). In situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni. Acta Materialia, 59(10), 4043-4054. https://doi.org/10.1016/j.actamat.2011.03.028

In situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni. / Gourlay, C. M.; Nogita, Kazuhiro; Dahle, A. K.; Yamamoto, Y.; Uesugi, K.; Nagira, T.; Yoshiya, M.; Yasuda, H.

In: Acta Materialia, Vol. 59, No. 10, 01.06.2011, p. 4043-4054.

Research output: Contribution to journalArticle

Gourlay, CM, Nogita, K, Dahle, AK, Yamamoto, Y, Uesugi, K, Nagira, T, Yoshiya, M & Yasuda, H 2011, 'In situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni', Acta Materialia, vol. 59, no. 10, pp. 4043-4054. https://doi.org/10.1016/j.actamat.2011.03.028
Gourlay CM, Nogita K, Dahle AK, Yamamoto Y, Uesugi K, Nagira T et al. In situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni. Acta Materialia. 2011 Jun 1;59(10):4043-4054. https://doi.org/10.1016/j.actamat.2011.03.028
Gourlay, C. M. ; Nogita, Kazuhiro ; Dahle, A. K. ; Yamamoto, Y. ; Uesugi, K. ; Nagira, T. ; Yoshiya, M. ; Yasuda, H. / In situ investigation of unidirectional solidification in Sn-0.7Cu and Sn-0.7Cu-0.06Ni. In: Acta Materialia. 2011 ; Vol. 59, No. 10. pp. 4043-4054.
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