In-situ observation of ultrasonic bonding using high speed camera

T. Shuto, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Room-temperature microjoining in the air ambient has been achieved by using cone-shaped Au bump with ultrasonic application. In-situ observation of the ultrasonic bonding is performed using a high speed camera for the purpose of investigating dynamics of the bonding process. 'Softening' of the bump under the application of ultrasonic is observed. It is suggested that bonding is almost completed within 100 ms.

Original languageEnglish
Title of host publicationProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PublisherIEEE Computer Society
Number of pages1
ISBN (Print)9781479952618
DOIs
Publication statusPublished - Jan 1 2014
Event2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 - Tokyo, Japan
Duration: Jul 15 2014Jul 16 2014

Publication series

NameProceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014

Other

Other2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
CountryJapan
CityTokyo
Period7/15/147/16/14

All Science Journal Classification (ASJC) codes

  • Filtration and Separation

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  • Cite this

    Shuto, T., & Asano, T. (2014). In-situ observation of ultrasonic bonding using high speed camera. In Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014 [6886184] (Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014). IEEE Computer Society. https://doi.org/10.1109/LTB-3D.2014.6886184