TY - GEN
T1 - In-situ observation of ultrasonic bonding using high speed camera
AU - Shuto, T.
AU - Asano, T.
N1 - Copyright:
Copyright 2014 Elsevier B.V., All rights reserved.
PY - 2014
Y1 - 2014
N2 - Room-temperature microjoining in the air ambient has been achieved by using cone-shaped Au bump with ultrasonic application. In-situ observation of the ultrasonic bonding is performed using a high speed camera for the purpose of investigating dynamics of the bonding process. 'Softening' of the bump under the application of ultrasonic is observed. It is suggested that bonding is almost completed within 100 ms.
AB - Room-temperature microjoining in the air ambient has been achieved by using cone-shaped Au bump with ultrasonic application. In-situ observation of the ultrasonic bonding is performed using a high speed camera for the purpose of investigating dynamics of the bonding process. 'Softening' of the bump under the application of ultrasonic is observed. It is suggested that bonding is almost completed within 100 ms.
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U2 - 10.1109/LTB-3D.2014.6886184
DO - 10.1109/LTB-3D.2014.6886184
M3 - Conference contribution
AN - SCOPUS:84906968913
SN - 9781479952618
T3 - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
SP - 45
BT - Proceedings of 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
PB - IEEE Computer Society
T2 - 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration, LTB-3D 2014
Y2 - 15 July 2014 through 16 July 2014
ER -