In situ observation of ultrasonic flip-chip bonding using high-speed camera

Takanori Shuto, Tanemasa Asano

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)

Abstract

Room-temperature microjoining in air ambient has been achieved by using a cone-shaped Au microbump with ultrasonic application. In situ observation of ultrasonic bonding is performed using a high-speed camera to investigate the dynamics of the bonding process. "Softening" of the bump under ultrasonic application is observed. It is suggested that bonding is achieved within 50 ms.

Original languageEnglish
Article number030204
JournalJapanese journal of applied physics
Volume54
Issue number3
DOIs
Publication statusPublished - Mar 1 2015

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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