TY - JOUR
T1 - In situ observation of ultrasonic flip-chip bonding using high-speed camera
AU - Shuto, Takanori
AU - Asano, Tanemasa
N1 - Publisher Copyright:
© 2015 The Japan Society of Applied Physics.
PY - 2015/3/1
Y1 - 2015/3/1
N2 - Room-temperature microjoining in air ambient has been achieved by using a cone-shaped Au microbump with ultrasonic application. In situ observation of ultrasonic bonding is performed using a high-speed camera to investigate the dynamics of the bonding process. "Softening" of the bump under ultrasonic application is observed. It is suggested that bonding is achieved within 50 ms.
AB - Room-temperature microjoining in air ambient has been achieved by using a cone-shaped Au microbump with ultrasonic application. In situ observation of ultrasonic bonding is performed using a high-speed camera to investigate the dynamics of the bonding process. "Softening" of the bump under ultrasonic application is observed. It is suggested that bonding is achieved within 50 ms.
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U2 - 10.7567/JJAP.54.030204
DO - 10.7567/JJAP.54.030204
M3 - Article
AN - SCOPUS:84924255032
SN - 0021-4922
VL - 54
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
IS - 3
M1 - 030204
ER -