In situ observation of ultrasonic flip-chip bonding using high-speed camera

Takanori Shuto, Tanemasa Asano

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

Room-temperature microjoining in air ambient has been achieved by using a cone-shaped Au microbump with ultrasonic application. In situ observation of ultrasonic bonding is performed using a high-speed camera to investigate the dynamics of the bonding process. "Softening" of the bump under ultrasonic application is observed. It is suggested that bonding is achieved within 50 ms.

Original languageEnglish
Article number030204
JournalJapanese Journal of Applied Physics
Volume54
Issue number3
DOIs
Publication statusPublished - Mar 1 2015

Fingerprint

high speed cameras
High speed cameras
Ultrasonic applications
ultrasonics
Ultrasonics
chips
softening
Cones
cones
air
room temperature
Air
Temperature

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

In situ observation of ultrasonic flip-chip bonding using high-speed camera. / Shuto, Takanori; Asano, Tanemasa.

In: Japanese Journal of Applied Physics, Vol. 54, No. 3, 030204, 01.03.2015.

Research output: Contribution to journalArticle

@article{8732f5d2c60d486b99510c57dc12c604,
title = "In situ observation of ultrasonic flip-chip bonding using high-speed camera",
abstract = "Room-temperature microjoining in air ambient has been achieved by using a cone-shaped Au microbump with ultrasonic application. In situ observation of ultrasonic bonding is performed using a high-speed camera to investigate the dynamics of the bonding process. {"}Softening{"} of the bump under ultrasonic application is observed. It is suggested that bonding is achieved within 50 ms.",
author = "Takanori Shuto and Tanemasa Asano",
year = "2015",
month = "3",
day = "1",
doi = "10.7567/JJAP.54.030204",
language = "English",
volume = "54",
journal = "Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes",
issn = "0021-4922",
publisher = "Institute of Physics",
number = "3",

}

TY - JOUR

T1 - In situ observation of ultrasonic flip-chip bonding using high-speed camera

AU - Shuto, Takanori

AU - Asano, Tanemasa

PY - 2015/3/1

Y1 - 2015/3/1

N2 - Room-temperature microjoining in air ambient has been achieved by using a cone-shaped Au microbump with ultrasonic application. In situ observation of ultrasonic bonding is performed using a high-speed camera to investigate the dynamics of the bonding process. "Softening" of the bump under ultrasonic application is observed. It is suggested that bonding is achieved within 50 ms.

AB - Room-temperature microjoining in air ambient has been achieved by using a cone-shaped Au microbump with ultrasonic application. In situ observation of ultrasonic bonding is performed using a high-speed camera to investigate the dynamics of the bonding process. "Softening" of the bump under ultrasonic application is observed. It is suggested that bonding is achieved within 50 ms.

UR - http://www.scopus.com/inward/record.url?scp=84924255032&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84924255032&partnerID=8YFLogxK

U2 - 10.7567/JJAP.54.030204

DO - 10.7567/JJAP.54.030204

M3 - Article

AN - SCOPUS:84924255032

VL - 54

JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes

SN - 0021-4922

IS - 3

M1 - 030204

ER -