In-situ strain measurement of ultrasonic ball bonding

Keiichiro Iwanabe, Kenichi Nakadozono, Yosuke Senda, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

Dynamic change in distribution of strain generated in Si under a pad electrode was measured during ultrasonic ball bonding by using newly developed Si strain sensor. The sensor was designed to be able to determine strains in the directions normal and parallel to the surface. Bonding of Cu and Au was measured. It was clearly observed that the position of the largest compressive strain moved from the center of the ball to the periphery according to the progress of bonding under the application of the ultrasonic. Bonding of Cu was found to generate larger strain than bonding of Au. Bonding of Cu was also found to induce under-pad damage. SEM observation of bonded balls suggested that the under-pad damage appeared at the positon where the edge of the capillary existed and at the time when the large force of ultrasonic vibration was applied.

Original languageEnglish
Title of host publication2016 6th Electronic System-Integration Technology Conference, ESTC 2016
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781509014026
DOIs
Publication statusPublished - Dec 1 2016
Event6th Electronic System-Integration Technology Conference, ESTC 2016 - Grenoble, France
Duration: Sep 13 2016Sep 16 2016

Publication series

Name2016 6th Electronic System-Integration Technology Conference, ESTC 2016

Other

Other6th Electronic System-Integration Technology Conference, ESTC 2016
CountryFrance
CityGrenoble
Period9/13/169/16/16

    Fingerprint

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Iwanabe, K., Nakadozono, K., Senda, Y., & Asano, T. (2016). In-situ strain measurement of ultrasonic ball bonding. In 2016 6th Electronic System-Integration Technology Conference, ESTC 2016 [7764689] (2016 6th Electronic System-Integration Technology Conference, ESTC 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ESTC.2016.7764689