Influence of bending strain on Bi-2223 tape

S. Nishimura, T. Kiss, M. Inoue, M. Ishimaru, M. Kiuchi, M. Takeo, H. Okamoto, T. Matsushita, K. Ito

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Abstract

The behavior of current-voltage (I-V) characteristics in Bi-2223 AgAgMg sheathed tape at various bending strain has been studied. The measured results were analyzed using the percolation model, and then the variation of critical current density, Jc, has been analyzed. As increasing of bending strain, Jc in the tape is reduced irreversible way. The irreversible degradation indicates that the Jc reduction is caused mainly by crack formation. However, if we extract statistic Jc distribution taking into account the cracking, it can be seen that the value of local Jc is enlarged in the remained region as the strain is increased. Namely, the pinning strength in the remained region is enlarged as the bending strain is increased. Present analysis allows us to separate the influence on grain connectivity and pinning strength originated from the strain.

Original languageEnglish
Pages (from-to)1001-1004
Number of pages4
JournalPhysica C: Superconductivity and its applications
Volume372-376
Issue numberPART 2
DOIs
Publication statusPublished - Aug 1 2002

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All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Energy Engineering and Power Technology
  • Electrical and Electronic Engineering

Cite this

Nishimura, S., Kiss, T., Inoue, M., Ishimaru, M., Kiuchi, M., Takeo, M., ... Ito, K. (2002). Influence of bending strain on Bi-2223 tape. Physica C: Superconductivity and its applications, 372-376(PART 2), 1001-1004. https://doi.org/10.1016/S0921-4534(02)00956-5