Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%)

S. A. Belyakov; T. Nishimura; K. Sweatman; K. Nogita; C. M. Gourlay

doi:10.1109/ICEP.2016.7486816

Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%)

S. A. Belyakov, T. Nishimura, K. Sweatman, K. Nogita, C. M. Gourlay

Faculty of Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys, with 5-8 independent βSn grains in each joint; (ii) Bi additions to Sn-0.7Cu-0.05Ni maintain this distinct βSn grain structure and had no discernible effect on the (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals.

Original language	English
Title of host publication	2016 International Conference on Electronics Packaging, ICEP 2016
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	222-225
Number of pages	4
ISBN (Electronic)	9784904090176
DOIs	https://doi.org/10.1109/ICEP.2016.7486816
Publication status	Published - Jun 7 2016
Event	2016 International Conference on Electronics Packaging, ICEP 2016 - Hokkaido, Japan Duration: Apr 20 2016 → Apr 22 2016

Publication series

Name	2016 International Conference on Electronics Packaging, ICEP 2016

Other

Other	2016 International Conference on Electronics Packaging, ICEP 2016
Country/Territory	Japan
City	Hokkaido
Period	4/20/16 → 4/22/16

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering
Mechanics of Materials

Access to Document

10.1109/ICEP.2016.7486816

Cite this

Belyakov, S. A., Nishimura, T., Sweatman, K., Nogita, K., & Gourlay, C. M. (2016). Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%). In 2016 International Conference on Electronics Packaging, ICEP 2016 (pp. 222-225). [7486816] (2016 International Conference on Electronics Packaging, ICEP 2016). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICEP.2016.7486816

Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%). / Belyakov, S. A.; Nishimura, T.; Sweatman, K.; Nogita, K.; Gourlay, C. M.

2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 222-225 7486816 (2016 International Conference on Electronics Packaging, ICEP 2016).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Belyakov, SA, Nishimura, T, Sweatman, K, Nogita, K & Gourlay, CM 2016, Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%). in 2016 International Conference on Electronics Packaging, ICEP 2016., 7486816, 2016 International Conference on Electronics Packaging, ICEP 2016, Institute of Electrical and Electronics Engineers Inc., pp. 222-225, 2016 International Conference on Electronics Packaging, ICEP 2016, Hokkaido, Japan, 4/20/16. https://doi.org/10.1109/ICEP.2016.7486816

Belyakov SA, Nishimura T, Sweatman K, Nogita K, Gourlay CM. Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%). In 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc. 2016. p. 222-225. 7486816. (2016 International Conference on Electronics Packaging, ICEP 2016). https://doi.org/10.1109/ICEP.2016.7486816

Belyakov, S. A. ; Nishimura, T. ; Sweatman, K. ; Nogita, K. ; Gourlay, C. M. / Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%). 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., 2016. pp. 222-225 (2016 International Conference on Electronics Packaging, ICEP 2016).

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abstract = "Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys, with 5-8 independent βSn grains in each joint; (ii) Bi additions to Sn-0.7Cu-0.05Ni maintain this distinct βSn grain structure and had no discernible effect on the (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals.",

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AU - Sweatman, K.

AU - Nogita, K.

AU - Gourlay, C. M.

PY - 2016/6/7

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N2 - Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys, with 5-8 independent βSn grains in each joint; (ii) Bi additions to Sn-0.7Cu-0.05Ni maintain this distinct βSn grain structure and had no discernible effect on the (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals.

AB - Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys, with 5-8 independent βSn grains in each joint; (ii) Bi additions to Sn-0.7Cu-0.05Ni maintain this distinct βSn grain structure and had no discernible effect on the (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals.

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Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%)

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