Abstract
Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys, with 5-8 independent βSn grains in each joint; (ii) Bi additions to Sn-0.7Cu-0.05Ni maintain this distinct βSn grain structure and had no discernible effect on the (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals.
| Original language | English |
|---|---|
| Title of host publication | 2016 International Conference on Electronics Packaging, ICEP 2016 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 222-225 |
| Number of pages | 4 |
| ISBN (Electronic) | 9784904090176 |
| DOIs | |
| Publication status | Published - Jun 7 2016 |
| Event | 2016 International Conference on Electronics Packaging, ICEP 2016 - Hokkaido, Japan Duration: Apr 20 2016 → Apr 22 2016 |
Publication series
| Name | 2016 International Conference on Electronics Packaging, ICEP 2016 |
|---|
Other
| Other | 2016 International Conference on Electronics Packaging, ICEP 2016 |
|---|---|
| Country | Japan |
| City | Hokkaido |
| Period | 4/20/16 → 4/22/16 |
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All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering
- Mechanics of Materials
Cite this
Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%). / Belyakov, S. A.; Nishimura, T.; Sweatman, K.; Nogita, K.; Gourlay, C. M.
2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., 2016. p. 222-225 7486816 (2016 International Conference on Electronics Packaging, ICEP 2016).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
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TY - GEN
T1 - Influence of Bi additions on the distinct βsn grain structure of Sn-0.7Cu-0.05Ni-xBi (x = 0-4wt%)
AU - Belyakov, S. A.
AU - Nishimura, T.
AU - Sweatman, K.
AU - Nogita, K.
AU - Gourlay, C. M.
PY - 2016/6/7
Y1 - 2016/6/7
N2 - Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys, with 5-8 independent βSn grains in each joint; (ii) Bi additions to Sn-0.7Cu-0.05Ni maintain this distinct βSn grain structure and had no discernible effect on the (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals.
AB - Effects of Bi additions to Ag-containing lead-free solders have been the focus of a considerable amount of past investigation. However, the influence of Bi on Sn-Cu-Ni solders has not been studied extensively. In the present study, we explore the influence of Bi on microstructure formation of Sn-0.7Cu-0.05Ni/Cu solder joints both in the bulk and at the interface. It is shown that (i) Sn-0.7Cu-0.05Ni solidifies to produce a markedly different grain structure to Ag-containing lead-free alloys, with 5-8 independent βSn grains in each joint; (ii) Bi additions to Sn-0.7Cu-0.05Ni maintain this distinct βSn grain structure and had no discernible effect on the (Cu,Ni)6Sn5 interfacial intermetallic layers or primary intermetallic crystals.
UR - http://www.scopus.com/inward/record.url?scp=84978284911&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84978284911&partnerID=8YFLogxK
U2 - 10.1109/ICEP.2016.7486816
DO - 10.1109/ICEP.2016.7486816
M3 - Conference contribution
AN - SCOPUS:84978284911
T3 - 2016 International Conference on Electronics Packaging, ICEP 2016
SP - 222
EP - 225
BT - 2016 International Conference on Electronics Packaging, ICEP 2016
PB - Institute of Electrical and Electronics Engineers Inc.
ER -