Influence of bonding time on the transient liquid phase bonding behavior of Hastelloy X using Ni-Cr-B-Si-Fe filler alloy

A. Malekan, M. Farvizi, S. E. Mirsalehi, Noritaka Saito, K. Nakashima

Research output: Contribution to journalArticle

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Abstract

The effects of different transient liquid phase (TLP) bonding times on the microstructure and mechanical properties of Hastelloy X joints made by Ni–Cr–B–Si–Fe filler alloy were investigated. The specimens were TLP bonded at 1070 °C for holding times of 5, 20, 80, 320, and 640 min. The electron probe microanalysis (EPMA) results revealed that the main eutectic phases observed at the joints following incomplete isothermal solidification were Ni-rich borides, Ni-rich silicides, Ni–Si eutectic, and some Cr-rich borides. A high density of plate-like, blocky, and acicular (Mo and Cr)-rich borides were observed in the diffusion-affected zone (DAZ) of the samples; however, increasing the holding time decreased the contents of these phases. The solid-state diffusion was found to be a more effective transportation phenomenon than base metal dissolution at longer holding times. The increased DAZ thickness and the complete isothermal solidification as a result of the improved solid-state diffusion helped increase the uniformity of the hardness profile of the TLP bond at higher holding times (320 and 640 min). The results showed reverse relationship between the athermally solidified zone (ASZ) width and the bonding strength. The highest tensile strength (∼617 MPa) was achieved for the sample bonded at a holding time of 320 min; this strength was more than 80% of the base metal strength. A fractographic analysis of the tensile failure revealed a cellular fracture surface, exhibiting the characteristics of both brittle and ductile fractures. The sites prone to stress concentration and crack initiation were reduced with the completion of isothermal solidification.

Original languageEnglish
Pages (from-to)37-49
Number of pages13
JournalMaterials Science and Engineering A
Volume755
DOIs
Publication statusPublished - May 7 2019

Fingerprint

Hastelloy (trademark)
Boron Compounds
fillers
Borides
Fillers
liquid phases
Solidification
borides
Liquids
Eutectics
solidification
Metals
eutectics
Silicides
Ductile fracture
Brittle fracture
Electron probe microanalysis
Crack initiation
solid state
Stress concentration

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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Influence of bonding time on the transient liquid phase bonding behavior of Hastelloy X using Ni-Cr-B-Si-Fe filler alloy. / Malekan, A.; Farvizi, M.; Mirsalehi, S. E.; Saito, Noritaka; Nakashima, K.

In: Materials Science and Engineering A, Vol. 755, 07.05.2019, p. 37-49.

Research output: Contribution to journalArticle

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