It has been demonstrated that the strength of an Al-Si-Cu alloy is maximized by high-temperature solution treatment at 807 K, which is approximately 16 K higher than the ternary eutectic temperature. The dual-energy K-edge subtraction imaging technique has been employed to obtain the spatial distribution of copper and its change during its solution treatment in three dimensions quantitatively, providing interpretations of the improved mechanical properties in terms of age-hardenability and its spatial variation. It has been also confirmed that the occurrence of incipient local melting and the accompanying growth of micro pores adjacent to the melt regions lead to fractures caused by these defects. However, it can be inferred that the positive effects can outweigh the negative effects even above the eutectic temperature, thereby realizing the maximum strength at such relative high temperature levels.
All Science Journal Classification (ASJC) codes
- Electronic, Optical and Magnetic Materials
- Ceramics and Composites
- Polymers and Plastics
- Metals and Alloys