Influence of microstructure on electrochemical properties of severely deformed AI-5 wt% Cu alloy by ECAP

Zuogui Zhang, Eiji Akiyama, Yoshimi Watanabe, Yasuyuki Katada, Kaneaki Tsuzaki

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)


The influence of microstructure on the electrochemical properties of an Al-5 wt% Cu binary alloy which was severely deformed by equal-channel angular pressing (ECAP) has been investigated in a borate-boric acid buffer solution containing Cl- ions at pH 8.3 and 25°C by potentiodynamic polarization test. The anodic polarization results showed that pitting potentials of ECAPed Al-Cu alloy samples were higher than that of the sample without ECAP and increased with repetitive ECAP passes. The pitting corrosion attack of Al-Cu alloy samples took place in the surroundings of Al2Cu (9) phase. It is considered that the grain refinement of 9 phase and the solid solution generated in Al matrix during ECAP process are responsible for the improvement of the corrosion resistance of ECAPed Al-Cu alloy.

Original languageEnglish
Title of host publicationAluminium Alloys 2006
Subtitle of host publicationResearch Through Innovation and Technology - Proceedings of the 10th International Conference on Aluminium Alloys
Number of pages6
EditionPART 1
Publication statusPublished - Dec 1 2006
Externally publishedYes
Event10th International Conference on Aluminium Alloys, (ICAA-10) - Vancouver, Canada
Duration: Jul 9 2006Jul 13 2006

Publication series

NameMaterials Science Forum
NumberPART 1
ISSN (Print)0255-5476


Other10th International Conference on Aluminium Alloys, (ICAA-10)

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering


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