Influence of stacking-fault energy on microstructural characteristics of ultrafine-grain copper and copper-zinc alloys

Levente Balogh, Tamás Ungár, Yonghao Zhao, Y. T. Zhu, Zenji Horita, Cheng Xu, Terence G. Langdon

Research output: Contribution to journalArticlepeer-review

206 Citations (Scopus)

Abstract

Experiments were conducted on samples of pure Cu and two Cu-Zn alloys to evaluate the influence of the stacking-fault energy (SFE) on microstructural development when processing using high-pressure torsion (HPT). Transmission electron microscopy, X-ray diffraction and hardness measurements were used for microstructural evaluation and the results show consistency between these techniques. Grain sizes in the nanometer range were formed at the edges of the HPT disks, larger submicrometer grains were formed in the disk centers and the measured grain sizes decreased with decreasing SFE. There was negligible twinning in pure Cu but the densities of dislocations and twins increased with increasing Zn content and thus with decreasing SFE. The values of the Vickers microhardness were lower in the centers of the disks for the two Cu-Zn alloy and this is consistent with the low SFE and slow rates of recovery.

Original languageEnglish
Pages (from-to)809-820
Number of pages12
JournalActa Materialia
Volume56
Issue number4
DOIs
Publication statusPublished - Feb 1 2008

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

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