TY - JOUR
T1 - Influence of stacking fault energy on microstructural development in equal-channel angular pressing
AU - Komura, Shogo
AU - Horita, Zenji
AU - Nemoto, Minoru
AU - Langdon, Terence G.
N1 - Funding Information:
We are grateful to members of the Hiroshige family (Nishiki Tekko Co., Kurume, Fukuoka, Japan) for fabricating the ECA pressing die with a singular circular channel and to Mr. T. Ogura and Mr. T. Hamamoto (Kobe Steel, Ltd., Chofu, Japan) for providing the Cu billet and the chemical analysis. This work was supported in part by the Light Metals Educational Foundation of Japan, in part by a Grant-in-Aid for Scientific Research from the Ministry of Education, Science, Sports, and Culture of Japan, in part by the Japan Society for the Promotion of Science, and in part by the National Science Foundation of the United States under Grant Nos. DMR-9625969 and INT-9602919.
PY - 1999/10
Y1 - 1999/10
N2 - Equal-channel angular (ECA) pressing is a procedure having the capability of introducing an ultrafine grain size into a material. Experiments were conducted to examine the effect of the low stacking fault energy in pure Cu on microstructural development during ECA pressing at room temperature. The results show that the low stacking fault energy and the consequent low rate of recovery lead to a very slow evolution of the microstructure during pressing. Ultimately, a stable grain size of -0.27 μm was established in pure Cu but the microstructure was not fully homogeneous even after pressing to a total strain of approximately 10. It is shown by static annealing that the as-pressed grains are stable up to approximately 400 K, but at higher temperatures there is grain growth. These results lead to the conclusion that a low stacking fault energy is especially favorable for the introduction of an exceptionally small grain size using the ECA pressing procedure.
AB - Equal-channel angular (ECA) pressing is a procedure having the capability of introducing an ultrafine grain size into a material. Experiments were conducted to examine the effect of the low stacking fault energy in pure Cu on microstructural development during ECA pressing at room temperature. The results show that the low stacking fault energy and the consequent low rate of recovery lead to a very slow evolution of the microstructure during pressing. Ultimately, a stable grain size of -0.27 μm was established in pure Cu but the microstructure was not fully homogeneous even after pressing to a total strain of approximately 10. It is shown by static annealing that the as-pressed grains are stable up to approximately 400 K, but at higher temperatures there is grain growth. These results lead to the conclusion that a low stacking fault energy is especially favorable for the introduction of an exceptionally small grain size using the ECA pressing procedure.
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U2 - 10.1557/JMR.1999.0546
DO - 10.1557/JMR.1999.0546
M3 - Article
AN - SCOPUS:0033276823
SN - 0884-2914
VL - 14
SP - 4044
EP - 4050
JO - Journal of Materials Research
JF - Journal of Materials Research
IS - 10
ER -