Influences of the inhomogeneities inside the head on the MEG source estimation

Keiji Iramina, Shoogo Ueno

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study focuses on the influence of inhomogeneities on source estimation from magnetoencephalograms (MEGs). These influences on the MEG source estimation are investigated by computer simulation. Using an inhomogeneous spherical model, the magnetic fields are calculated. In the inverse problem, a homogeneous spherical model is used. The errors of the source parameters are obtained. Computer simulation shows that the effect of inhomogeneities, in particular, effects of inhomogeneities with the high conductivity, cannot be disregarded for the estimation of the source parameter.

Original languageEnglish
Title of host publicationProceedings of the Annual Conference on Engineering in Medicine and Biology
PublisherPubl by IEEE
Pages2325-2326
Number of pages2
Editionpt 5
ISBN (Print)0780302168
Publication statusPublished - Dec 1 1991
Externally publishedYes
EventProceedings of the 13th Annual International Conference of the IEEE Engineering in Medicine and Biology Society - Orlando, FL, USA
Duration: Oct 31 1991Nov 3 1991

Publication series

NameProceedings of the Annual Conference on Engineering in Medicine and Biology
Numberpt 5
Volume13
ISSN (Print)0589-1019

Other

OtherProceedings of the 13th Annual International Conference of the IEEE Engineering in Medicine and Biology Society
CityOrlando, FL, USA
Period10/31/9111/3/91

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All Science Journal Classification (ASJC) codes

  • Signal Processing
  • Biomedical Engineering
  • Computer Vision and Pattern Recognition
  • Health Informatics

Cite this

Iramina, K., & Ueno, S. (1991). Influences of the inhomogeneities inside the head on the MEG source estimation. In Proceedings of the Annual Conference on Engineering in Medicine and Biology (pt 5 ed., pp. 2325-2326). (Proceedings of the Annual Conference on Engineering in Medicine and Biology; Vol. 13, No. pt 5). Publ by IEEE.