Integrated laser Doppler blood flowing combining optical contact force

Hirofumi Nogami, Kosuke Komatsutani, Tomoki Hirata, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Laser Doppler blood flowmeter (LDF) is a non-invasive method for measuring micro circulation, and has been developed since 1977. It is necessary to control contact force between a LDF and measurement part (skin surface), in order to obtain accurate blood flow. We suggest new multifunctional sensor modules which can measure both blood flow and contact force. A sensor module has a multi-layer ceramic chip with vertical cavity surface emitting laser (VCSEL), photo diodes, and op-Amp circuits, and a hollow shell with a mirror and a lug. Some of incident light penetrates into a finger, and the scattering light, which have biological signal (blood flow) are detected by one photodiode. On the other hand, a photodiode can detect reflecting light from a mirror, which is displaced by a contact force. In this paper, we fabricate multifunctional sensor module and attempt to simultaneously measure the blood flow and contact force.

Original languageEnglish
Title of host publication2019 International Conference on Electronics Packaging, ICEP 2019
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages287-290
Number of pages4
ISBN (Electronic)9784990218867
DOIs
Publication statusPublished - Apr 1 2019
Event2019 International Conference on Electronics Packaging, ICEP 2019 - Niigata, Japan
Duration: Apr 17 2019Apr 20 2019

Publication series

Name2019 International Conference on Electronics Packaging, ICEP 2019

Conference

Conference2019 International Conference on Electronics Packaging, ICEP 2019
CountryJapan
CityNiigata
Period4/17/194/20/19

Fingerprint

Blood
Lasers
Flowmeters
Photodiodes
Sensors
Mirrors
Microcirculation
Operational amplifiers
Surface emitting lasers
Light scattering
Skin
Diodes
Networks (circuits)

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials
  • Metals and Alloys

Cite this

Nogami, H., Komatsutani, K., Hirata, T., & Sawada, R. (2019). Integrated laser Doppler blood flowing combining optical contact force. In 2019 International Conference on Electronics Packaging, ICEP 2019 (pp. 287-290). [8733508] (2019 International Conference on Electronics Packaging, ICEP 2019). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.23919/ICEP.2019.8733508

Integrated laser Doppler blood flowing combining optical contact force. / Nogami, Hirofumi; Komatsutani, Kosuke; Hirata, Tomoki; Sawada, Renshi.

2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. p. 287-290 8733508 (2019 International Conference on Electronics Packaging, ICEP 2019).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Nogami, H, Komatsutani, K, Hirata, T & Sawada, R 2019, Integrated laser Doppler blood flowing combining optical contact force. in 2019 International Conference on Electronics Packaging, ICEP 2019., 8733508, 2019 International Conference on Electronics Packaging, ICEP 2019, Institute of Electrical and Electronics Engineers Inc., pp. 287-290, 2019 International Conference on Electronics Packaging, ICEP 2019, Niigata, Japan, 4/17/19. https://doi.org/10.23919/ICEP.2019.8733508
Nogami H, Komatsutani K, Hirata T, Sawada R. Integrated laser Doppler blood flowing combining optical contact force. In 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc. 2019. p. 287-290. 8733508. (2019 International Conference on Electronics Packaging, ICEP 2019). https://doi.org/10.23919/ICEP.2019.8733508
Nogami, Hirofumi ; Komatsutani, Kosuke ; Hirata, Tomoki ; Sawada, Renshi. / Integrated laser Doppler blood flowing combining optical contact force. 2019 International Conference on Electronics Packaging, ICEP 2019. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 287-290 (2019 International Conference on Electronics Packaging, ICEP 2019).
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