Integrated micro laser doppler velocimeter with 3-D structure

Eiji Higurashi, Tadatomo Suga, Renshi Sawada

    Research output: Chapter in Book/Report/Conference proceedingConference contribution

    2 Citations (Scopus)

    Abstract

    Compact and thin micro laser Doppler velocimetry (LDV) sensor with 3-D structure (2.8 mm x 2.8 mm x 1 mm thick) was developed using Au-Au surface-activated bonding method (bonding temperature: 150 °C). It consists of two elements: a glass substrate with bonded photodiode chips, electrodes, and refractive microlenses; and a micromachined Si substrate with a submount, a bonded laser diode chip, micromirrors, and through-silicon vias. The feasibility of measuring velocity was demonstrated for various moving objects such as a reflective grating, an Au wire, and a light diffusing ground glass. The micro LDV sensor detected relative speeds as low as 0.4 μm/s and Doppler beat signal frequency showed good linearity to the relative velocity.

    Original languageEnglish
    Title of host publicationIEEE Sensors 2010 Conference, SENSORS 2010
    Pages2409-2412
    Number of pages4
    DOIs
    Publication statusPublished - Dec 1 2010
    Event9th IEEE Sensors Conference 2010, SENSORS 2010 - Waikoloa, HI, United States
    Duration: Nov 1 2010Nov 4 2010

    Publication series

    NameProceedings of IEEE Sensors

    Other

    Other9th IEEE Sensors Conference 2010, SENSORS 2010
    CountryUnited States
    CityWaikoloa, HI
    Period11/1/1011/4/10

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering

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