Integration and packaging technologies for small biomedical sensors

Eiji Higurashi, Renshi Sawada, Tadatomo Suga

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)1190-1194
Number of pages5
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume73
Issue number11
DOIs
Publication statusPublished - Dec 1 2007

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Packaging
Sensors

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

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Integration and packaging technologies for small biomedical sensors. / Higurashi, Eiji; Sawada, Renshi; Suga, Tadatomo.

In: Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, Vol. 73, No. 11, 01.12.2007, p. 1190-1194.

Research output: Contribution to journalArticle

Higurashi, Eiji ; Sawada, Renshi ; Suga, Tadatomo. / Integration and packaging technologies for small biomedical sensors. In: Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering. 2007 ; Vol. 73, No. 11. pp. 1190-1194.
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