Intermetallic formation and fluidity in Sn-Rich Sn-Cu-Ni alloys

C. M. Gourlay, Kazuhiro Nogita, J. Read, A. K. Dahle

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

This paper investigates the phase equilibria and solidification behavior of Sn-Cu-Ni alloys with compositions in the range of 0 wt.% to 1.5 wt.% Cu and 0 wt.% to 0.3 wt.% Ni. The isothermal section at 268°C in the Sn-rich corner was determined. No evidence for a ternary phase was found, and the section is in good agreement with past experimental studies that report wide solubility ranges for (Cu,Ni) 6Sn 5 and (Ni,Cu) 3Sn 4. The vacuum fluidity test was applied to compositions that are liquid at 268°C to map the variation in microstructure and flow behavior with composition in this system. Significant variations in fluidity length were measured among the Sn-Cu-Ni alloys, and the variations correlate with the microstructure that develops during solidification. The generated fluidity map enables the selection of Sn-Cu-Ni solder compositions that exhibit good fluidity behavior during solidification and form near-eutectic microstructures.

Original languageEnglish
Pages (from-to)56-69
Number of pages14
JournalJournal of Electronic Materials
Volume39
Issue number1
DOIs
Publication statusPublished - Jan 1 2010

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Fluidity
Intermetallics
intermetallics
solidification
Solidification
Chemical analysis
microstructure
Microstructure
vacuum tests
solders
Phase equilibria
eutectics
Soldering alloys
Eutectics
solubility
Solubility
Vacuum
Liquids
liquids

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

Cite this

Intermetallic formation and fluidity in Sn-Rich Sn-Cu-Ni alloys. / Gourlay, C. M.; Nogita, Kazuhiro; Read, J.; Dahle, A. K.

In: Journal of Electronic Materials, Vol. 39, No. 1, 01.01.2010, p. 56-69.

Research output: Contribution to journalArticle

Gourlay, C. M. ; Nogita, Kazuhiro ; Read, J. ; Dahle, A. K. / Intermetallic formation and fluidity in Sn-Rich Sn-Cu-Ni alloys. In: Journal of Electronic Materials. 2010 ; Vol. 39, No. 1. pp. 56-69.
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