Interrupted in situ EBSD study of texture evolution and mechanism of surface grains in electroformed Ni after annealing with an initially duplex 〈100〉 + 〈111〉 fiber texture during uniaxial tensile deformation

Kai Jiang, Hiroaki Nakano, Satoshi Oue, Tatsuya Morikawa, Zhipeng Li, Wenhuai Tian

Research output: Contribution to journalArticle

Abstract

The texture evolution process and mechanism of surface grains in electroformed Ni after annealing with an initially duplex 〈100⟩ + 〈111〉 fiber texture during uniaxial tensile deformation were investigated by using interrupted in situ electron backscattered diffraction. The results showed that the initially duplex 〈100〉 + 〈111〉 fiber texture evolved into the metastable Cube orientation with a weak Cu orientation during the uniaxial tensile deformation. The volume fractions of 〈100〉 and 〈111〉 fiber texture decreased from 54.0% to 29.3% and 16.6% to 6.6%, respectively. The volume of the Cube orientation remained almost stable at 12%, whereas that of the Cu orientation increased from 1% to 2.9%. A simulation of the final preferred orientation based on the Taylor model was a cubic texture, which qualitatively agreed well with the experimental result. The simulated results indicated that the formed Cube and Cu textures evolved from the initial 〈100〉 and 〈111〉 fiber textures, respectively.

Original languageEnglish
Pages (from-to)238-247
Number of pages10
JournalMaterials Characterization
Volume141
DOIs
Publication statusPublished - Jul 1 2018

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tensile deformation
textures
Textures
Annealing
annealing
fibers
Fibers
Electron diffraction
Volume fraction
electron diffraction

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

@article{c7531baa51214d68b2c10d4fade40923,
title = "Interrupted in situ EBSD study of texture evolution and mechanism of surface grains in electroformed Ni after annealing with an initially duplex 〈100〉 + 〈111〉 fiber texture during uniaxial tensile deformation",
abstract = "The texture evolution process and mechanism of surface grains in electroformed Ni after annealing with an initially duplex 〈100⟩ + 〈111〉 fiber texture during uniaxial tensile deformation were investigated by using interrupted in situ electron backscattered diffraction. The results showed that the initially duplex 〈100〉 + 〈111〉 fiber texture evolved into the metastable Cube orientation with a weak Cu orientation during the uniaxial tensile deformation. The volume fractions of 〈100〉 and 〈111〉 fiber texture decreased from 54.0{\%} to 29.3{\%} and 16.6{\%} to 6.6{\%}, respectively. The volume of the Cube orientation remained almost stable at 12{\%}, whereas that of the Cu orientation increased from 1{\%} to 2.9{\%}. A simulation of the final preferred orientation based on the Taylor model was a cubic texture, which qualitatively agreed well with the experimental result. The simulated results indicated that the formed Cube and Cu textures evolved from the initial 〈100〉 and 〈111〉 fiber textures, respectively.",
author = "Kai Jiang and Hiroaki Nakano and Satoshi Oue and Tatsuya Morikawa and Zhipeng Li and Wenhuai Tian",
year = "2018",
month = "7",
day = "1",
doi = "10.1016/j.matchar.2018.05.004",
language = "English",
volume = "141",
pages = "238--247",
journal = "Materials Characterization",
issn = "1044-5803",
publisher = "Elsevier Inc.",

}

TY - JOUR

T1 - Interrupted in situ EBSD study of texture evolution and mechanism of surface grains in electroformed Ni after annealing with an initially duplex 〈100〉 + 〈111〉 fiber texture during uniaxial tensile deformation

AU - Jiang, Kai

AU - Nakano, Hiroaki

AU - Oue, Satoshi

AU - Morikawa, Tatsuya

AU - Li, Zhipeng

AU - Tian, Wenhuai

PY - 2018/7/1

Y1 - 2018/7/1

N2 - The texture evolution process and mechanism of surface grains in electroformed Ni after annealing with an initially duplex 〈100⟩ + 〈111〉 fiber texture during uniaxial tensile deformation were investigated by using interrupted in situ electron backscattered diffraction. The results showed that the initially duplex 〈100〉 + 〈111〉 fiber texture evolved into the metastable Cube orientation with a weak Cu orientation during the uniaxial tensile deformation. The volume fractions of 〈100〉 and 〈111〉 fiber texture decreased from 54.0% to 29.3% and 16.6% to 6.6%, respectively. The volume of the Cube orientation remained almost stable at 12%, whereas that of the Cu orientation increased from 1% to 2.9%. A simulation of the final preferred orientation based on the Taylor model was a cubic texture, which qualitatively agreed well with the experimental result. The simulated results indicated that the formed Cube and Cu textures evolved from the initial 〈100〉 and 〈111〉 fiber textures, respectively.

AB - The texture evolution process and mechanism of surface grains in electroformed Ni after annealing with an initially duplex 〈100⟩ + 〈111〉 fiber texture during uniaxial tensile deformation were investigated by using interrupted in situ electron backscattered diffraction. The results showed that the initially duplex 〈100〉 + 〈111〉 fiber texture evolved into the metastable Cube orientation with a weak Cu orientation during the uniaxial tensile deformation. The volume fractions of 〈100〉 and 〈111〉 fiber texture decreased from 54.0% to 29.3% and 16.6% to 6.6%, respectively. The volume of the Cube orientation remained almost stable at 12%, whereas that of the Cu orientation increased from 1% to 2.9%. A simulation of the final preferred orientation based on the Taylor model was a cubic texture, which qualitatively agreed well with the experimental result. The simulated results indicated that the formed Cube and Cu textures evolved from the initial 〈100〉 and 〈111〉 fiber textures, respectively.

UR - http://www.scopus.com/inward/record.url?scp=85046632547&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85046632547&partnerID=8YFLogxK

U2 - 10.1016/j.matchar.2018.05.004

DO - 10.1016/j.matchar.2018.05.004

M3 - Article

VL - 141

SP - 238

EP - 247

JO - Materials Characterization

JF - Materials Characterization

SN - 1044-5803

ER -