TY - JOUR
T1 - Investigating the mechanical properties, creep and crack pattern of Cu6Sn5 and (Cu,Ni)6Sn5 on diverse crystal planes
AU - Mu, D.
AU - Huang, H.
AU - McDonald, S. D.
AU - Read, J.
AU - Nogita, K.
N1 - Funding Information:
This research was conducted under an international cooperative research program between the University of Queensland (UQ), Australia and Nihon Superior Company, Japan, and was supported by an ARC-Linkage project (ID: LP100200250 ). The authors would like to thank Dr Y.Q. Wu, Mr R. Irwan, Ms Z.L. Lin and Ms M.Y. Lu for assistance with experimentation. The authors acknowledge the facilities, and the scientific and technical assistance, of the Australian Microscopy & Microanalysis Research Facility at the Centre for Microscopy and Microanalysis, UQ. DM acknowledges the financial support received in the form of an Australian Postgraduate Award (APA).
PY - 2013
Y1 - 2013
N2 - Cu6Sn5 is an important intermetallic compound (IMC) commonly formed during lead-free soldering. It is known that Cu6Sn5 exhibits significantly different thermo-mechanical deformation behaviour compared to both bulk solder alloys and their substrates. In high-density 3-D electrical packages individual solder joints may contain only a few grains of Cu6Sn5. The knowledge of the mechanical properties, creep and crack behaviour of Cu6Sn5 on different crystal planes is therefore essential to understanding the deformation of lead-free solder joints in service. In this research, the mechanical properties, creep and crack patterns on diverse crystal planes of hexagonal Cu6Sn5 and (Cu,Ni)6Sn5 were investigated using electron back scattered diffraction (EBSD), scanning electron microscopy (SEM) and nanoindentation. It was found that the mechanical properties, creep and crack patterns of hexagonal Cu6Sn5 were strongly related to the crystal orientation. The addition of Ni was found to reduce the anisotropy in hardness and the creep of Cu6Sn5 and had a significant effect on the crack patterns of Cu6Sn5.
AB - Cu6Sn5 is an important intermetallic compound (IMC) commonly formed during lead-free soldering. It is known that Cu6Sn5 exhibits significantly different thermo-mechanical deformation behaviour compared to both bulk solder alloys and their substrates. In high-density 3-D electrical packages individual solder joints may contain only a few grains of Cu6Sn5. The knowledge of the mechanical properties, creep and crack behaviour of Cu6Sn5 on different crystal planes is therefore essential to understanding the deformation of lead-free solder joints in service. In this research, the mechanical properties, creep and crack patterns on diverse crystal planes of hexagonal Cu6Sn5 and (Cu,Ni)6Sn5 were investigated using electron back scattered diffraction (EBSD), scanning electron microscopy (SEM) and nanoindentation. It was found that the mechanical properties, creep and crack patterns of hexagonal Cu6Sn5 were strongly related to the crystal orientation. The addition of Ni was found to reduce the anisotropy in hardness and the creep of Cu6Sn5 and had a significant effect on the crack patterns of Cu6Sn5.
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U2 - 10.1016/j.msea.2012.12.057
DO - 10.1016/j.msea.2012.12.057
M3 - Article
AN - SCOPUS:84874486571
VL - 566
SP - 126
EP - 133
JO - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
JF - Materials Science & Engineering A: Structural Materials: Properties, Microstructure and Processing
SN - 0921-5093
ER -