Kinetics of the polymorphic phase transformation of Cu6Sn 5

Guang Zeng, Stuart D. McDonald, Jonathan J. Read, Qinfen Gu, Kazuhiro Nogita

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31 Citations (Scopus)

Abstract

Cu6Sn5 is a critical intermetallic compound in soldering and three-dimensional integrated circuit packaging technology and exists in at least five different crystal structures in the solid state, with a polymorphic phase transformation from hexagonal to monoclinic structures occurring on cooling. The kinetics of polymorphic transformations in Sn-rich Cu6Sn5 and Cu-rich Cu6Sn5 is systematically investigated in this study. This includes the generation of continuous cooling transformation diagrams as well as time-temperature transformation diagrams. Techniques used include variable temperature synchrotron powder X-ray diffraction and differential scanning calorimetry. The findings have important implications for the manufacture of solder joints and their in-service performance.

Original languageEnglish
Pages (from-to)135-148
Number of pages14
JournalActa Materialia
Volume69
DOIs
Publication statusPublished - May 1 2014

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Ceramics and Composites
  • Polymers and Plastics
  • Metals and Alloys

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    Zeng, G., McDonald, S. D., Read, J. J., Gu, Q., & Nogita, K. (2014). Kinetics of the polymorphic phase transformation of Cu6Sn 5. Acta Materialia, 69, 135-148. https://doi.org/10.1016/j.actamat.2014.01.027